JPMorgan Chase Bank, 2.68% 23may2030, CNY (Structured) (FIGI BBG00XTS94S6, XS2244331158)
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International bonds, Structured product, Senior Unsecured
Issue
| Borrower
Borrower
Redemption (put/call option)
The JPMorgan Chase Bank bond XS2244331158 is a CNY-denominated Senior Unsecured debt security with a maturity date of 23/05/2030. The bond currently holds the status outstanding and reflects a country of risk of USA. Key parameters of the issue include a minimum settlement amount of 100,000 CNY, a placement amount of 12,430,000 CNY and an outstanding amount of 12,430,000 CNY, which together indicate how much of the debt remains in circulation. The issue contains no embedded call or put options, and its cash flows follow the original redemption terms. Detailed information about the security can also be found in the prospectus, if such a document exists for the given issue. For reference and reconciliation, the bond is identified by ISIN - XS2244331158, FIGI - BBG00XTS94S6, CFI - DTVNGR, Common Code - 224433115, Ticker - JPM 2.68 05/23/30 OCT.