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KEPCO, 3.57% 30jul2029, USD (5) (FIGI BBG006W2J666, XS1091714250, WKN A3LA54)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
100,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Republic of Korea
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    100,000,000 USD
  • Outstanding amount
    100,000,000 USD
  • USD equivalent
    100,000,000 USD
  • Minimum Settlement Amount
    1,000,000 USD
  • ISIN
    XS1091714250
  • Common Code
    109171425
  • CFI
    DTFUFB
  • FIGI
    BBG006W2J666
  • Ticker
    KORELE 3.57 07/30/29 GMTN

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Issue information

Profile
Kepco, Inc. designs and manufactures electronic power supplies. The Company offers digital and analog controlled converters, linear and programmable switch mode power supplies, and accessories. Kepco serves customers in the State of New York.
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Volume
  • Placement amount
    100,000,000 USD
  • Outstanding amount
    100,000,000 USD
  • Outstanding face value amount
    100,000,000 USD
Face value
  • Minimum Settlement Amount
    1,000,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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indices

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

16/07/2026 New issues: KEPCO issued international bonds (USY4907LAU62, USY4907LAT99) in the amount of USD 300, USD 400 mln maturing in 2031, 2029 respectively.
30/06/2026 Upcoming Issue: KEPCO 5Y
30/06/2026 Upcoming Issue: KEPCO 3Y
07/02/2025 New issue: KEPCO issued international bonds (USY4907LAL63) with the coupon rate of 4.75% in the amount of USD 400 mln maturing in 2028
03/02/2025 Upcoming Issue: KEPCO
All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
IV q eng
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Identifiers

  • ISIN
    XS1091714250
  • Cbonds ID
    82347
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    109171425
  • CFI
    DTFUFB
  • FIGI
    BBG006W2J666
  • WKN
    A3LA54
  • Ticker
    KORELE 3.57 07/30/29 GMTN
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Bearer
  • Non-complex financial instruments (MiFID)
  • Non-Marketable Securities
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

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