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Ingram Micro, 5.25% 1sep2017, USD (FIGI BBG0014SLKX7, WKN A1A0BY)

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International bonds

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Matured
Amount
300,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    300,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • Common Code
    053573967
  • CFI
    DBFUGR
  • FIGI
    BBG0014SLKX7
  • SEDOL
    B56CBR8
  • Ticker
    IM 5.25 09/01/17

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Issue information

Profile
Ingram Micro Inc. (Ingram Micro) is a global information technology (IT) supply-chain management, mobile device lifecycle services and logistics solutions. The Company distribute and market hundreds of thousands of technology products worldwide from the industry’s computer ...
Ingram Micro Inc. (Ingram Micro) is a global information technology (IT) supply-chain management, mobile device lifecycle services and logistics solutions. The Company distribute and market hundreds of thousands of technology products worldwide from the industry’s computer hardware suppliers, mobility hardware suppliers, networking equipment suppliers, software publishers, and other suppliers of computer peripherals, consumer electronics (CE), physical security, automatic identification and data capture (AIDC)/point-of-sale (POS) and physical security products. The Company has operations in 37 countries. In October 15, 2012, the Company acquired Brightpoint, Inc. In February 2013, it opened a new business unit, Ingram Micro Mobility, at Mobile World Congress in Barcelona, Spain. In September 2013, the Company announced that it has acquired SoftCom Inc. In October 2013, the Company acquired Norcross, Ga.-based CloudBlue Technologies, Inc. (CloudBlue). Ingram Micro Inc. is a subsidiary of Tianjin Tianhai Investment Co., Ltd.
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  • Borrower
    Go to the issuer page
    Ingram Micro
  • Full borrower / issuer name
    Ingram Micro
  • Sector
    Corporate
  • Industry
    Wholesale Trade
Volume
  • Placement amount
    300,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

24/10/2024 Ingram Micro Holding Shares Rise in NYSE Debut
24/10/2024 Ingram Micro Prices IPO
15/10/2024 Ingram Micro Launches IPO of 18.6 Million Shares
11/12/2014 New bond issue: December 10, 2014 Ingram Micro placed USD 500.0m in bonds with a 4.95% coupon
All organization news

IFRS/US GAAP reports

2016
I q eng
II q eng
III q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    80791
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    053573967
  • CFI
    DBFUGR
  • FIGI
    BBG0014SLKX7
  • WKN
    A1A0BY
  • SEDOL
    B56CBR8
  • Ticker
    IM 5.25 09/01/17
  • Type of security by CBR
    ***
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Ratings

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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