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Lam Research, 2.875% 15jun2050, USD (FIGI BBG00TLB8TH8, WKN A28W1P)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
750,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    750,000,000 USD
  • Outstanding amount
    750,000,000 USD
  • USD equivalent
    750,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFNGR
  • FIGI
    BBG00TLB8TH8
  • SEDOL
    BKY6M63
  • Ticker
    LRCX 2.875 06/15/50
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Issue information

Profile
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. Lam Research designs, manufactures, markets, refurbish, and services semiconductor processing equipment used in the fabrication of integrated ...
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. Lam Research designs, manufactures, markets, refurbish, and services semiconductor processing equipment used in the fabrication of integrated circuits. The Company’s etch and clean technologies enable customers to build integrated circuits. Its etch systems shape the microscopic conductive and dielectric layers into circuits that define a chip’s final use and function. Its Customer Support Business Group (CSBG) provides products and services to maximize installed equipment performance and operational efficiency. Its customer base includes semiconductor memory, foundry, and integrated device manufacturers (IDMs) that make DRAM, NAND, and logic devices for these products. In June 2012, Lam Research completed its merger with Novellus Systems, Inc.
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Volume
  • Placement amount
    750,000,000 USD
  • Outstanding amount
    750,000,000 USD
  • Outstanding face value amount
    750,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Covenants

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Latest issues

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IFRS/US GAAP reports

2026
I q eng
II q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    721405
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFNGR
  • FIGI
    BBG00TLB8TH8
  • WKN
    A28W1P
  • SEDOL
    BKY6M63
  • Ticker
    LRCX 2.875 06/15/50
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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