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NXP Semiconductors, 3.15% 1may2027, USD (FIGI RegS BBG00TJX9V14, WKN A28WXQ)

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International bonds, Guaranteed, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
2,700,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Netherlands
Current coupon
***%
Price
Yield / Duration
Reports of guarantors / borrowers / offerers
Guarantor NXP Semiconductors
Reporting IFRS
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    2,700,000 USD
  • USD equivalent
    2,700,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI RegS
    DBFNGR
  • FIGI RegS
    BBG00TJX9V14
  • Ticker
    NXPI 3.15 05/01/27 REGS
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Everything you need for fixed income research and monitoring.

  • 00:23 Coverage
  • 00:40 Bond screener
  • 00:54 Parameters
  • 01:10 Watchlist, Mobile app
  • 01:15 Excel Add-in
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Issue information

Profile
NXP Semiconductors N.V. (NXP) is a holding company. The Company is a semiconductor company. The Company provides High Performance Mixed Signal and Standard Product solutions. Its product solutions are used in a range of automotive, identification, ...
NXP Semiconductors N.V. (NXP) is a holding company. The Company is a semiconductor company. The Company provides High Performance Mixed Signal and Standard Product solutions. Its product solutions are used in a range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. The Company operates in two segments: High Performance Mixed Signal and Standard Products and other reportable segment, Manufacturing Operations. The Company sells two categories of products, High Performance Mixed Signal product solutions and Standard Products. The first category consisted of application-specific High Performance Mixed Signal semiconductors and system solutions. The second of its product categories consist of devices can be incorporated in many different types of electronics equipment.
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Volume
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    2,700,000 USD
  • Outstanding face value amount
    2,700,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Private investor

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Business Day Convention
    Following Business Day
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

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Get access
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— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

Latest issues

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Similar issues

News

29/04/2026 NXP Semiconductors (NASDAQ: NXPI) Reports Strong Earnings and Positive Outlook Amidst Chip Market Recovery
04/02/2026 NXP Semiconductors N.V. (NASDAQ:NXPI) Overview and Financial Performance
04/02/2026 NXP Semiconductors: Departure Of Directors Or Principal Officers; Election Of Directors; Appointment Of Principal Officers, Financial Statements And Exhibits
29/10/2025 NXP Semiconductors N.V. (NASDAQ: NXPI) Overview
27/10/2025 NXP Semiconductors: Results Of Operations And Financial Condition, Departure Of Directors Or Certain Officers; Election Of Directors; Appointment Of Certain Officers; Compensatory Arrangements Of Certain Officers, Financial Statements And Exhibits
All organization news

IFRS/US GAAP reports

2026
I q eng
II q eng
2025
I q eng
II q eng
III q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
III q eng
IV q eng
2018
IV q eng
2017
IV q eng
2016
IV q eng
2015
IV q eng
2014
IV q eng
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Identifiers

  • ISIN RegS
    ***
  • Cbonds ID
    721127
  • ISIN 144A
    ***
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • CFI RegS
    DBFNGR
  • CFI 144A
    DBFNGR
  • FIGI RegS
    BBG00TJX9V14
  • FIGI 144A
    BBG00TJX9TX4
  • WKN RegS
    A28WXQ
  • Ticker
    NXPI 3.15 05/01/27 REGS
  • Type of security by CBR
    ***
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Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Guaranteed
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

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