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HP Inc., 6.125% 1mar2014, USD (US428236AT06)

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International bonds

Status
Matured
Amount
2,000,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI on
Country of risk
USA
Current coupon
-
Price
-
Yield / Duration
-
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    2,000,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • ISIN
    US428236AT06
  • Common Code
    040398546
  • CFI
    DBFUGR
  • FIGI
    BBG0000K9237
  • SEDOL
    B3K9Z02
  • Ticker
    HPQ 6.125 03/01/14

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Files

Prospectus

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Trading chart

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Bond is not traded; the issue is redeemed
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Data display in a chart | table
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Issue information

Profile
HP (also known as HP Inc. and stylized as hp) is an American technology company which develops personal computers (PCs), printers and related supplies, as well as 3D Printing solutions. It was formed on November 1, 2015, ...
HP (also known as HP Inc. and stylized as hp) is an American technology company which develops personal computers (PCs), printers and related supplies, as well as 3D Printing solutions. It was formed on November 1, 2015, renamed from the personal computer and printer divisions of the original Hewlett-Packard Company, with its enterprise products and services businesses becoming Hewlett Packard Enterprise. The split was structured so that Hewlett-Packard changed its name to HP Inc. and spun off Hewlett Packard Enterprise as a new publicly traded company. HP Inc. retains Hewlett-Packard's pre-2015 stock price history and its former stock ticker symbol, HPQ, while Hewlett Packard Enterprise trades under its own symbol, HPE.
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Volume
  • Placement amount
    2,000,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD
Listing
  • Listing
    ***

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

explore the most comprehensive database

900 000

bonds globally

Over 400

pricing sources

80 000

stocks

116 000

ETF & Funds

track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 900 000 bonds, 80 000 stocks, 116 000 ETF & Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 650K bonds, 76K stocks, 8K ETFs
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

29/05/2025 HP Inc Q2 EPS Misses Despite Revenue Beat, Guidance Cut Weighs
29/05/2025 HP Inc. (NYSE:HPQ) Quarterly Earnings Overview
28/05/2025 HP Inc.: Results Of Operations And Financial Condition, Financial Statements And Exhibits
15/04/2025 New issues: HP Inc. issued international bonds (US40434LAR69, US40434LAS43) in the amount of USD 500, USD 500 mln maturing in 2030, 2035 respectively.
14/04/2025 Upcoming Issue: HP Inc. 10Y
All organization news

IFRS/US GAAP reports

2025
I q eng
2024
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2023
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2022
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2021
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2020
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2019
I q eng
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III q eng
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2018
I q eng
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2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
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IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    55159
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    040398546
  • CFI
    DBFUGR
  • FIGI
    BBG0000K9237
  • SEDOL
    B3K9Z02
  • Ticker
    HPQ 6.125 03/01/14
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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