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NXP B.V., 3.875% 18jun2026, USD (FIGI RegS BBG00PF4CXD9, WKN A2R3S5)

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International bonds, Guaranteed, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Early redeemed
Amount
750,000,000 USD
Placement
***
Early redemption
*** (-)
ACI
Country of risk
Netherlands
Current coupon
***%
Price
Yield / Duration
Reports of guarantors / borrowers / offerers
Guarantor NXP Semiconductors
Reporting IFRS
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    750,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI RegS
    DBFNGR
  • FIGI RegS
    BBG00PF4CXD9
  • Ticker
    NXPI 3.875 06/18/26 REGS

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Bond is not traded; the issue is redeemed
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Data display in a chart | table
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Work with the chart: switching the price, period, issue comparison
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Issue information

Profile
NXP B.V. manufactures and sells semiconductor chips. The companys products include amplifiers, bipolar transistors, data converters, diodes, logic devices, microcontrollers, power management integrated circuits (ICs), radio frequency devices, sensors, thyristors, MOSFETs, interface and connectivity solutions, and ...
NXP B.V. manufactures and sells semiconductor chips. The companys products include amplifiers, bipolar transistors, data converters, diodes, logic devices, microcontrollers, power management integrated circuits (ICs), radio frequency devices, sensors, thyristors, MOSFETs, interface and connectivity solutions, and identification and security solutions, as well as ESD, EMI, and signal conditioning. Its Standard Products business supplies a range of standard semiconductor components, such as small signal discrete, power discrete and integrated discrete, and mobile device speakers and receivers.
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  • Borrower
    Go to the issuer page
    NXP B.V.
  • Full borrower / issuer name
    NXP B.V.
  • Sector
    Corporate
  • Industry
    Semiconductors
Volume
  • Placement amount
    750,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

80 234

stocks

167 970

ETF & Funds

70 000

indices

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

Latest issues

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Similar issues

News

07/10/2025 How To YieldBoost NXP Semiconductors From 1.8% To 5.6% Using Options
18/08/2025 New issues: NXP B.V. issued international bonds (US62954HBH03, US62954HBF47, US62954HBG20) in the amount of USD 700, USD 500, USD 300 mln maturing in 2035, 2028, 2032 respectively.
19/05/2022 New issue: Issuer NXP B.V. issued international bonds (US62954HBE71) with the coupon rate of 4.4% in the amount of USD 500 mln maturing in 2027
18/05/2022 New issue: Issuer NXP B.V. issued international bonds (US62954HBB33) with the coupon rate of 5% in the amount of USD 1000 mln maturing in 2033
16/11/2021 New bond issue: NXP B.V. issued international bonds (USN6600AAJ27) with a 3.125% coupon maturing in 2042
All organization news

Identifiers

  • ISIN RegS
    ***
  • Cbonds ID
    549413
  • ISIN 144A
    ***
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • CFI RegS
    DBFNGR
  • CFI 144A
    DBFNGR
  • FIGI RegS
    BBG00PF4CXD9
  • FIGI 144A
    BBG00PF4BYG5
  • WKN RegS
    A2R3S5
  • Ticker
    NXPI 3.875 06/18/26 REGS
  • Type of security by CBR
    ***
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Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Guaranteed
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

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