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TSW Industries Bonds, 6% 29mar2024, EUR (FIGI BBG00NTJQDB7, IT0005364945)

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Domestic bonds, Senior Unsecured

Status
Matured
Amount
2,000,000 EUR
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Italy
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
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  • Placement amount
    2,000,000 EUR
  • Outstanding amount
    2,000,000 EUR
  • Face value
    1,000 EUR
  • ISIN
    IT0005364945
  • CFI
    DBVUBB
  • FIGI
    BBG00NTJQDB7
  • Ticker
    TSWIDS 6 03/29/24

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Issue information

Profile
W Industries is the leading edge company in chocolate moulding and packaging technology solutions, incorporating the world-renowned Tecnosweet and Hitech Systems brands. From distribution and feeding systems, flow wrapping, cartoning, loading and closing to case packing ...
W Industries is the leading edge company in chocolate moulding and packaging technology solutions, incorporating the world-renowned Tecnosweet and Hitech Systems brands. From distribution and feeding systems, flow wrapping, cartoning, loading and closing to case packing and ends fold wrapping, TSW’s solution based approach is gained from thousands of installations around the world.
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  • Issuer
    Go to the issuer page
    TSW Industries
  • Full borrower / issuer name
    TSW Industries
  • Sector
    Corporate
  • Industry
    Other Sectors
Volume
  • Placement amount
    2,000,000 EUR
  • Outstanding amount
    2,000,000 EUR
Face value
  • Face value
    1,000 EUR
  • Outstanding face value
    *** EUR
  • Increment
    *** EUR

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Representative of the company 7 days FREE trial

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

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Early redemption terms

***

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1 000 000

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80 234

stocks

167 970

ETF & Funds

70 000

indices

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds
    Capital Expenditures
    Investment
  • Use of proceeds description
    The issue is made to financially support the growth plan aimed at achieving consolidation in the reference market (machinery for flexible or rigid packaging, mainly for the confectionery sector), growth in other outlet markets (cosmetics, beauty care, beverage) and the development of new technological solutions applicable to the modeling and packaging activity (eg vertical packaging, casting). The plan provides for the use of resources for a total amount of 5,000,000 Euros. Investments are based on the following guidelines: * to extend the technological know-how to business segments judged to have high development potential, and in particular to the realization of machinery for the wrapping of chocolate-based products and packaging machines for solid and liquid products in flexible packages (sc. "doypack") * insertion of new human resources in the technical / design field (strengthening the technological know-how the Company makes available to its customers), commercial field (support the dimensional growth of the business, approach new customers in new industrial sectors, consolidate the Company's reputation on the international market), managerial / administrative field (adapt the organizational structure to the increased operational dimensions) * progressively develop after-sales service, assistance and maintenance activities alongside the core design business
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

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Identifiers

  • ISIN
    IT0005364945
  • Cbonds ID
    523085
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBVUBB
  • FIGI
    BBG00NTJQDB7
  • Ticker
    TSWIDS 6 03/29/24
  • Type of security by CBR
    ***

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Bearer
  • Amortization
  • Non-complex financial instruments (MiFID)
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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