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TSMC Bonds, 2.1% 25sep2023, TWD (102-4) (FIGI BBG005795HN3, B618BL, TW000B618BL1)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Matured
Amount
2,600,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    2,600,000,000 TWD
  • Outstanding amount
    2,600,000,000 TWD
  • Face value
    10,000,000 TWD
  • ISIN
    TW000B618BL1
  • CFI
    DBFUFR
  • FIGI
    BBG005795HN3
  • Ticker
    TAISEM 2.1 09/25/23 024F

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Bond is not traded; the issue is redeemed
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Issue information

Profile
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes ...
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
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Volume
  • Placement amount
    2,600,000,000 TWD
  • Outstanding amount
    2,600,000,000 TWD
Face value
  • Face value
    10,000,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

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bonds

80 234

stocks

167 970

ETF & Funds

70 000

indices

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— Are you looking for the complete & verified bond data?

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Why

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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News

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IFRS/US GAAP reports

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2019
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Identifiers

  • State registration number
    B618BL
  • ISIN
    TW000B618BL1
  • Cbonds ID
    513553
  • CFI
    DBFUFR
  • FIGI
    BBG005795HN3
  • Ticker
    TAISEM 2.1 09/25/23 024F
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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