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Advanced Micro Devices, 7.5% 15aug2022, USD (FIGI BBG004J9LDZ1, WKN A1HKU1)

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International bonds, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Matured
Amount
499,615,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    499,615,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFUGR
  • FIGI
    BBG004J9LDZ1
  • SEDOL
    BBFKKG7
  • Ticker
    AMD 7.5 08/15/22

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Bond is not traded; the issue is redeemed
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Issue information

Profile
Advanced Micro Devices, Inc. (AMD) is a global semiconductor company with facilities around the world. The Company offers x86 microprocessors, as standalone devices or as incorporated as an accelerated processing unit (APU), for the commercial and ...
Advanced Micro Devices, Inc. (AMD) is a global semiconductor company with facilities around the world. The Company offers x86 microprocessors, as standalone devices or as incorporated as an accelerated processing unit (APU), for the commercial and consumer markets, embedded microprocessors for commercial, commercial client and consumer markets and chipsets for desktop and mobile devices, including mobile personal computers, or PCs, and tablets, professional workstations and servers and graphics, video and multimedia products for desktop and mobile devices, including mobile PCs and tablets, home media PCs and professional workstations, servers and technology for game consoles. In September 2013, Advanced Micro Devices Inc announced that its Singapore subsidiary, Advanced Micro Devices (Singapore) Pte Ltd. completed a transaction to sell and lease-back its Singapore facility located at 508 Chai Chee Lane, Singapore 469032 to HSBC Institutional Trust Services (Singapore) Limited.
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Volume
  • Placement amount
    499,615,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***
  • Depository
    ***

Conversion and exchange

Covenants

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Latest issues

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Similar issues

News

01/06/2026 Barclays Boosts Price Target for Advanced Micro Devices (NASDAQ:AMD) Amid Strong Semiconductor Growth and AI Competition
13/05/2026 Advanced Micro Devices: Entry Into A Material Definitive Agreement, Termination Of A Material Definitive Agreement, Creation Of A Direct Financial Obligation Or An Obligation Under An, Departure Of Directors Or Certain Officers; Election Of Directors; Appointment Of Certain Officers; Compensatory Arrangements Of Certain Officers, Submission Of Matters To A Vote Of Security Holders, Financial Statements And Exhibits
06/05/2026 Advanced Micro Devices (NASDAQ:AMD) Soars on Strong AI Demand and Analyst Upgrade
05/05/2026 Advanced Micro Devices (NASDAQ:AMD) Earnings Preview: Data Center and AI Fuel Growth
17/04/2026 Advanced Micro Devices (NASDAQ: AMD) Surges Amidst AI Boom and Semiconductor Industry Shifts
All organization news

IFRS/US GAAP reports

2025
I q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    500061
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUGR
  • FIGI
    BBG004J9LDZ1
  • WKN
    A1HKU1
  • SEDOL
    BBFKKG7
  • Ticker
    AMD 7.5 08/15/22
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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