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Domestic bonds: Huawei Technologies, 5.3% 18may2015, CNY
HK0000111952

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Foreign bonds

Issue
Issuer
  • M/S&P/F
    -/-/-
    -/-/-
Status
Matured
Amount
1,000,000,000 CNY
Placement
***
Early redemption
*** (-)
Country of risk
China
Current coupon
***%
Price
***%
Yield / Duration
-
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Issue information

Profile
Huawei Technologies Co. Ltd. is a Chinese multinational networking and telecommunications equipment and services company headquartered in Shenzhen, Guangdong. It is the largest telecommunications equipment maker in the world, having overtaken Ericsson in 2012.
Volume
  • Amount
    1,000,000,000 CNY
Nominal
  • Nominal
    1,000,000 CNY
  • Outstanding face value
    *** CNY
  • Par amount, integral multiple
    *** CNY

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count fraction
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Delay days
    *** days
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Early redemption terms

***

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to order full access
DATA PLATFORM FOR FINANCIAL MARKET PROFESSIONALS AND INVESTORS
  • High performance interface for global bond market screening
  • Full information on close to 450,000 bonds from 180 countries
  • 100% coverage of Eurobonds worldwide
  • Over 300 primary sources of prices
  • Ratings data from all international and local ratings agencies
  • Stock market data from 90 world trading floors
  • Intuitive, high speed user interface
  • Data access via the website, mobile application and add-in for Microsoft Excel

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** (***) - *** (***)
  • Coupon (Yield) Guidance
    ***% - ***% (*** - ***%)
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** CNY
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Listing
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***

Conversion and exchange

  • Convertion date
    ***
  • Initial premium
    ***%
  • Convertible until
    ***
  • Lock-up
    *** days
  • Conversion terms
    ***

Additional information

***

Latest issues

Show all

News

13/05/2015 New bond issue: Huawei Technologies sells USD 1,000.0m in 2025 bonds with a 4.125% coupon
All organization news

Identifiers

  • Registration
    ***
  • Date of program registration
    ***
  • ISIN
    HK0000111952
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    077657401
  • CFI
    DBFXFR
  • FIGI
    BBG002Z7ZCD2
  • Ticker
    HUAWEI 5.3 05/18/15
  • Type of security by CBR
    ***

Bond classification

  • Registered
  • Coupon bonds
  • Foreign bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Floating rate
  • For qualified investors (CIS region)
  • Green bonds
  • Indexed
  • Supranational bond issues
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

***

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