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International bonds: MagnaChip Semiconductor, 6.63% 15jul2021, USD
USU5565DAA29

  • Placement amount
    225 USD
  • Outstanding amount
    225 USD
  • Minimum Settlement Amount
    2 USD
  • ISIN RegS
    USU5565DAA29
  • Common Code RegS
    095484433
  • CFI RegS
    DBFUGR
  • FIGI RegS
    BBG004TVVQQ1
  • SEDOL
    BCD53K6
  • Ticker
    MX 6.625 07/15/21 REGS
DATA PLATFORM FOR FINANCIAL MARKET PROFESSIONALS AND INVESTORS
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  • Full information on close to 500,000 bonds from 180 countries
  • 100% coverage of Eurobonds worldwide
  • Over 300 primary sources of prices
  • Ratings data from all international and local ratings agencies
  • Stock market data from 100 world trading floors
  • Intuitive, high speed user interface
  • Data access via the website, mobile application and add-in for Microsoft Excel

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Bond is not traded; the issue is redeemed
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Issue information

Profile
MagnaChip is a premier Korea-based designer and manufacturer of analog and mixed-signal semiconductor products. We offer our global customers one of the broadest and deepest analog and mixed-signal semiconductor technology platforms in the industry. Our cutting edge ...
MagnaChip is a premier Korea-based designer and manufacturer of analog and mixed-signal semiconductor products. We offer our global customers one of the broadest and deepest analog and mixed-signal semiconductor technology platforms in the industry. Our cutting edge technology platform is supported by our 30-year operating history, large portfolio of approximately 7,000 registered and pending patents and extensive engineering and manufacturing process expertise. MagnaChip’s wide variety of analog and mixed-signal semiconductor products and services, combined with our technology platform enable us to address multiple high growth end markets and to develop and introduce new products quickly. With our long standing management presence in Asia, manufacturing facilities in Korea, and design centers in Korea and Japan, our proximity to the global electronic supply chain gives us the ability to quickly respond to customers’ needs and better service demand from existing and new customers. MagnaChip’s leading edge product portfolio includes solutions for high volume consumer applications such as mobile phones, digital televisions, flat panel displays, notebook computers, mobile multimedia devices and digital cameras.
  • Borrower
    Go to the issuer page
    MagnaChip Semiconductor
  • Full borrower / issuer name
    MagnaChip Semiconductor Ltd
  • Sector
    corporate
  • Industry
    Engineering industry
Volume
  • Placement amount
    225,000,000 USD
  • Outstanding amount
    225,000,000 USD
Nominal
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Par amount, integral multiple
    *** USD
  • Nominal
    1,000 USD

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count fraction
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Delay days
    *** days
  • Maturity date
    ***
  • Early redemption date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot

Early redemption terms

***

DATA PLATFORM FOR FINANCIAL MARKET PROFESSIONALS AND INVESTORS
  • High performance interface for global bond market screening
  • Full information on close to 500,000 bonds from 180 countries
  • 100% coverage of Eurobonds worldwide
  • Over 300 primary sources of prices
  • Ratings data from all international and local ratings agencies
  • Stock market data from 100 world trading floors
  • Intuitive, high speed user interface
  • Data access via the website, mobile application and add-in for Microsoft Excel

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** (***) - *** (***)
  • Coupon (Yield) Guidance
    ***% - ***% (*** - ***%)
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** USD
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Listing
    ***
Participants
  • Bookrunner
    ***, ***

Conversion and exchange

Additional information

***

Latest issues

Issue Volume, mln Date Status
<app-asterisks >***</app-asterisks>
Early redeemed
<app-asterisks >***</app-asterisks>
Matured

Identifiers

  • Registration
    ***
  • Date of program registration
    ***
  • ISIN RegS
    ***
  • ISIN 144A
    ***
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    095484433
  • CFI RegS
    DBFUGR
  • CFI 144A
    DBFUGR
  • FIGI RegS
    BBG004TVVQQ1
  • FIGI 144A
    BBG004TTFVC8
  • SEDOL
    BCD53K6
  • Ticker
    MX 6.625 07/15/21 REGS
  • Type of security by CBR
    ***

Ratings



Bond classification

  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Floating rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Indexed
  • Supranational bond issues
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Subordinated
  • Sukuk
  • Trace-eligible

Restructuring

***

***