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Semiconductor Manufacturing International Corporation, 2% perp., USD (Conv.) (FIGI RegS BBG00JCQ6BW1, XS1730881247, WKN A190RY)

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International bonds, Perpetual, Convertible, Subordinated Unsecured

Issue | Borrower
Borrower
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
485,100,000 USD
Placement
***
Redemption (put/call option)
Perpetual (-)
ACI
Country of risk
China
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    485,100,000 USD
  • Outstanding amount
    485,100,000 USD
  • USD equivalent
    485,100,000 USD
  • Minimum Settlement Amount
    250,000 USD
  • ISIN RegS
    XS1730881247
  • Common Code RegS
    173088124
  • CFI RegS
    DCFXQR
  • FIGI RegS
    BBG00JCQ6BW1
  • Ticker
    SMIZCH 2 PERP
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Issue information

Profile
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, providing integrated circuit (IC) foundry and technology ...
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong.
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Volume
  • Placement amount
    485,100,000 USD
  • Outstanding amount
    485,100,000 USD
  • Outstanding face value amount
    485,100,000 USD
Face value
  • Minimum Settlement Amount
    250,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    250,000 USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***
  • Depository
    ***
  • Arranger Legal Adviser (International law)
    ***
  • Issuer Legal Adviser (Domestic law)
    ***
  • Issuer Legal Adviser (International law)
    ***, ***
  • Paying agent
    ***
  • Trustee
    ***

Conversion and exchange

  • Convertible until
    ***
  • Conversion terms
    ***

Covenants

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Latest issues

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Similar issues

News

16/06/2025 Taiwan Blacklists Chinese Chipmakers Huawei, SMIC
07/10/2024 Top China Chipmaker Gains $12bn on Stimulus, Push to Dump Nvidia
19/06/2024 US ‘Wants Allies to Block Equipment to More China Chipmakers’
24/05/2024 Applied Materials in Hot Water For Gear Sent to China Chipmaker
10/05/2024 China Chipmaker SMIC Sees Revenue Jump 20% Amid Demand Woes
All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
II q eng
IV q eng
2016
I q eng
II q eng
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Identifiers

  • ISIN RegS
    XS1730881247
  • Cbonds ID
    385627
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    173088124
  • CFI RegS
    DCFXQR
  • FIGI RegS
    BBG00JCQ6BW1
  • WKN RegS
    A190RY
  • Ticker
    SMIZCH 2 PERP
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Subordinated Unsecured
  • Registered
  • Coupon bonds
  • Convertible
  • Perpetual
  • Subordinated
  • Amortization
  • Callable
  • CDO
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Sukuk
  • Trace-eligible
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Restructuring

***

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