Hong Kong Science and Technology Parks Corporation Bonds, 3.2% 11jul2024, HKD (FIGI BBG006RZY1L6, HK0000206018, WKN A1ZL6G)

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Domestic bonds, Senior Unsecured

Status

Matured

Amount

852,000,000 HKD

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

Hong Kong

Current coupon

Price

Yield / Duration

Placement amount

852,000,000 HKD
Outstanding amount

852,000,000 HKD
Face value

1,500,000 HKD
ISIN

HK0000206018
Common Code

108606061
CFI

DTFUFR
FIGI

BBG006RZY1L6
Ticker

HKSTP 3.2 07/11/24 MTN

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Issue information

Profile

The company provides research and product development facilities, infrastructure, services, and programs that support science and technology companies to develop ideas, innovate, and grow in Hong Kong and the region.

Research report by Cbonds-PRAAMS

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Issuer

Go to the issuer page
Hong Kong Science and Technology Parks Corporation
Full borrower / issuer name

Hong Kong Science and Technology Parks Corporation
Sector

Corporate
Industry

Other Sectors

Volume

Placement amount

852,000,000 HKD
Outstanding amount

852,000,000 HKD

Face value

Face value

1,500,000 HKD
Outstanding face value

*** HKD
Increment

*** HKD

Listing

Listing

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Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

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Bond Search
Watchlist
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— Are you looking for the complete & verified bond data?

— We have everything you need:

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

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Enhance your portfolio management with Cbonds Excel Add-in

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Placement

Placement method

Open subscription
Placement type

Public
Placement

***
Geographic breakdown

***
Investor breakdown

***

Conversion and exchange

Conversion terms

***

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Identifiers

ISIN

HK0000206018
Cbonds ID

270171
CUSIP

***
CUSIP 144A

***
Common Code

108606061
CFI

DTFUFR
FIGI

BBG006RZY1L6
WKN

A1ZL6G
Ticker

HKSTP 3.2 07/11/24 MTN
Type of security by CBR

***

Bond classification

Senior Unsecured
Registered
Coupon bonds
Non-complex financial instruments (MiFID)
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***