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Telekom Malaysia, 3.422% 15nov2026, USD (FIGI BBG00F811FD6, XS1514809349)

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International bonds, Sukuk, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
75,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Malaysia
Current profit share rate
***%
Price
Yield / Duration
  • Placement amount
    75,000,000 USD
  • Outstanding amount
    75,000,000 USD
  • USD equivalent
    75,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • ISIN
    XS1514809349
  • Common Code
    151480934
  • CFI
    DAFNAR
  • FIGI
    BBG00F811FD6
  • Ticker
    TELMAL 3.422 11/15/26 EMTN

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Issue information

Profile
Telekom Malaysia Berhad establishes, provides, and maintains telecommunication and related services. Through its subsidiaries, the Company provides payphone network, mobile telecommunication, public telephone, and leasing of optical fiber telecommunication system services. Telekom also manages and operates ...
Telekom Malaysia Berhad establishes, provides, and maintains telecommunication and related services. Through its subsidiaries, the Company provides payphone network, mobile telecommunication, public telephone, and leasing of optical fiber telecommunication system services. Telekom also manages and operates Kuala Lumpur Tower and provides intelligent security services.
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Volume
  • Placement amount
    75,000,000 USD
  • Outstanding amount
    75,000,000 USD
  • Outstanding face value amount
    75,000,000 USD
Face value
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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stocks

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ETF & Funds

100 000

indices

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***
  • Arranger Legal Adviser (Domestic law)
    ***
  • Arranger Legal Adviser (International law)
    ***
  • Issuer Legal Adviser (Domestic law)
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

24/02/2016 New bond issue: Telekom Malaysia issued international bonds for USD 50.0m maturing in 2026 with a 3.7% coupon.
All organization news

IFRS/US GAAP reports

2025
I q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
IV q eng
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Related entities on 31/12/2021

Have shares in the company

Identifiers

  • ISIN
    XS1514809349
  • Cbonds ID
    267993
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    151480934
  • CFI
    DAFNAR
  • FIGI
    BBG00F811FD6
  • Ticker
    TELMAL 3.422 11/15/26 EMTN
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Sukuk
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Trace-eligible
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Restructuring

***

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