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Globalfoundries Singapore, 6.25% 4apr2013, USD (FIGI BBG00008L551)

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International bonds

Status
Matured
Amount
300,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Singapore
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    300,000,000 USD
  • Outstanding amount
    300,000,000 USD
  • Minimum Settlement Amount
    1,000 USD
  • Common Code
    025043294
  • CFI
    DBFUFR
  • FIGI
    BBG00008L551
  • SEDOL
    B1287V8
  • Ticker
    CSMSP 6.25 04/04/13

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Bond is not traded; the issue is redeemed
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Issue information

Profile
Prior to 2010, Chartered Semiconductor Manufacturing (abbreviated CSM) was the world's third largest dedicated independent semiconductor foundry, with its headquarters and main operations located in the Woodlands Industrial Park, Kranji Singapore. The company was listed on ...
Prior to 2010, Chartered Semiconductor Manufacturing (abbreviated CSM) was the world's third largest dedicated independent semiconductor foundry, with its headquarters and main operations located in the Woodlands Industrial Park, Kranji Singapore. The company was listed on the Singapore Exchange under the trading symbol of CHARTERED, as well as on NASDAQ (CHRT), until its buyout. In September 2009, it was announced that Chartered Semiconductor was about to be acquired by the main stockholder of GlobalFoundries, a joint venture between AMD and Advanced Technology Investment Company(ATIC), of Abu Dhabi, United Arab Emirates.
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  • Borrower
    Go to the issuer page
    Globalfoundries Singapore
  • Full borrower / issuer name
    Globalfoundries Singapore
  • Sector
    Corporate
  • Industry
    Semiconductors
Volume
  • Placement amount
    300,000,000 USD
  • Outstanding amount
    300,000,000 USD
Face value
  • Minimum Settlement Amount
    1,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Why

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Placement

  • Placement method
    Open subscription
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

Identifiers

  • ISIN
    ***
  • Cbonds ID
    25299
  • CUSIP
    ***
  • Common Code
    025043294
  • CFI
    DBFUFR
  • FIGI
    BBG00008L551
  • SEDOL
    B1287V8
  • Ticker
    CSMSP 6.25 04/04/13
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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