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Semiconductor Manufacturing International Corporation, 0% 7jul2022, USD (Conv.) (FIGI RegS BBG00D20VSK0, XS1432320429, WKN A1822U)

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International bonds, Convertible, Zero-coupon bonds, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Matured
Amount
642,500,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
China
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    650,000,000 USD
  • Outstanding amount
    642,500,000 USD
  • Minimum Settlement Amount
    100,000 USD
  • ISIN RegS
    XS1432320429
  • Common Code RegS
    143232042
  • CFI RegS
    DCZNDR
  • FIGI RegS
    BBG00D20VSK0
  • Ticker
    SMIZCH 0 07/07/22 981

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Prospectus (2 pcs.)

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Bond is not traded; the issue is redeemed
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Issue information

Profile
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, providing integrated circuit (IC) foundry and technology ...
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, providing integrated circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer. Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. SMIC also has customer service and marketing offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong.
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Volume
  • Placement amount
    650,000,000 USD
  • Outstanding amount
    642,500,000 USD
Face value
  • Minimum Settlement Amount
    100,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Business Day Convention
    Following Business Day
  • Interest Accrual Date
    ***
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

Auctions and additional placements

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    *** - ***
  • Initial issue amount
    *** USD
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***
  • Arranger Legal Adviser (International law)
    ***
  • Issuer Legal Adviser (International law)
    ***
  • Issuer Legal Adviser (Listing law)
    ***

Conversion and exchange

  • Initial premium
    ***%
  • Convertible until
    ***
  • Conversion terms
    ***

Covenants

  • Change of Control

    ***

  • Collective Action Clause

    ***

  • Covenant Suspension/Fall-Away

    ***

  • Cross Default

    ***

  • Designation of Restricted and Unrestricted Subsidiaries

    ***

  • Events of Default

    ***

  • Financial Covenants

    ***

  • Limitation on Business Activities

    ***

  • Limitation on Dividend and Other Payment Restrictions Affecting Restricted Subsidiaries

    ***

  • Limitation on Indebtedness

    ***

  • Limitation on Investments

    ***

  • Limitation on Liens

    ***

  • Limitation on Restricted Payments

    ***

  • Limitation on Sale of Assets

    ***

  • Limitation on Sale/Leaseback

    ***

  • Limitation on Subsidiary Debt

    ***

  • Limitation on layering (anti-layering)

    ***

  • Limitations on transactions with affiliates

    ***

  • Merger Restrictions

    ***

  • Others

    ***

  • Rating Trigger

    ***

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Latest issues

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07/10/2024 Top China Chipmaker Gains $12bn on Stimulus, Push to Dump Nvidia
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IFRS/US GAAP reports

2026
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2025
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2024
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2023
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2022
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2021
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2020
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2019
I q eng
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2018
I q eng
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2017
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2016
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Identifiers

  • ISIN RegS
    XS1432320429
  • Cbonds ID
    237916
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    143232042
  • CFI RegS
    DCZNDR
  • FIGI RegS
    BBG00D20VSK0
  • WKN RegS
    A1822U
  • Ticker
    SMIZCH 0 07/07/22 981
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Zero-coupon bonds
  • Senior Unsecured
  • Registered
  • Convertible
  • Amortization
  • Callable
  • CDO
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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