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United Microelectronics Corporation Bonds, 0% 3sep2031, TWD (Conv.) (23032, TW0002303203)

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Domestic bonds, Convertible, Zero-coupon bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
4,000,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    4,000,000,000 TWD
  • Outstanding amount
    4,000,000,000 TWD
  • USD equivalent
    126,843,190.11 USD
  • Face value
    100,000 TWD
  • ISIN
    TW0002303203
  • CFI
    DCZUDR
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Issue information

Profile
United Microelectronics Corporation was founded as Taiwan's first semiconductor company in 1980 as a spin-off of the government-sponsored Industrial Technology Research Institute (ITRI)
Research report by Cbonds-PRAAMS Save
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Report download is available only paid Premium subscription access
Volume
  • Placement amount
    4,000,000,000 TWD
  • Outstanding amount
    4,000,000,000 TWD
  • Outstanding face value amount
    4,000,000,000 TWD
  • USD equivalent
    126,843,190 USD
Face value
  • Face value
    100,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

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100 000

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ETF & Funds

100 000

indices

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— Are you looking for the complete & verified bond data?

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Initial premium
    ***%
  • Convertible until
    ***
  • Conversion terms
    ***

Latest issues

Show all

News

All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
IV q eng
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Identifiers

  • State registration number
    23032
  • ISIN
    TW0002303203
  • Cbonds ID
    2338141
  • CFI
    DCZUDR
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Zero-coupon bonds
  • Senior Unsecured
  • Convertible
  • Amortization
  • Callable
  • CDO
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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