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United Microelectronics Corporation Bonds, 0% 7aug2031, TWD (Conv.) (FIGI BBG0243HRR72, TW0002303104)
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Domestic bonds, Convertible, Zero-coupon bonds, Senior Unsecured
Status
Outstanding
Amount
12,000,000,000 TWD
Placement
Redemption (put/call option)
ACI
TWD
No data
Country of risk
Taiwan
Current coupon
Price
Yield / Duration
The United Microelectronics Corporation bond TW0002303104 is a TWD-denominated Senior Unsecured debt security with a maturity date of 07/08/2031. The bond has the following coupon terms: 0.00%. The bond currently holds the status "outstanding" and reflects a country of risk of Taiwan. On this page you can track quotes from 2 sources (such as exchanges and market participants), including bid and ask quotes if any, and follow changes in the bond's price and yield over time. Key parameters of the issue include a face value of 100,000 TWD, a placement amount of 12,000,000,000 TWD and an outstanding amount of 12,000,000,000 TWD, which together indicate how much of the debt remains in circulation. The issue carries embedded call and put options detailed in the redemption schedule. In essence, this means that the issuer may redeem it early and the holder may sell it back on set dates. Detailed information about the security can also be found in the prospectus. For reference and reconciliation, the bond is identified by ISIN - TW0002303104, FIGI - BBG0243HRR72, CFI - DCZUDR, Ticker - UNIMIC 0 08/07/31 1.
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