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Tencent Holdings Bonds, 2.5% 16jun2036, CNY (31) (FIGI BBG022W00P38, HK0001307179)

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Domestic bonds, Foreign bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
11,000,000,000 CNY
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
China
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    11,000,000,000 CNY
  • Outstanding amount
    11,000,000,000 CNY
  • USD equivalent
    1,634,955,952.8 USD
  • Face value
    10,000 CNY
  • ISIN
    HK0001307179
  • Common Code
    339694125
  • CFI
    DTFNFR
  • FIGI
    BBG022W00P38
  • Ticker
    TENCNT 2.5 06/16/36 GMTN
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Issue information

Profile
Tencent Holdings Limited, an investment holding company, provides Internet and mobile value-added services (VAS), online advertising services, and e-commerce transactions services to users in the People's Republic of China, the United States, Europe, and internationally. Tencent ...
Tencent Holdings Limited, an investment holding company, provides Internet and mobile value-added services (VAS), online advertising services, and e-commerce transactions services to users in the People's Republic of China, the United States, Europe, and internationally. Tencent is the world's largest gaming and social media company, one of the world's most valuable technology companies, and one of the world's largest venture capital firms and investment corporations.
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Volume
  • Placement amount
    11,000,000,000 CNY
  • Outstanding amount
    11,000,000,000 CNY
  • Outstanding face value amount
    11,000,000,000 CNY
  • USD equivalent
    1,634,955,953 USD
Face value
  • Face value
    10,000 CNY
  • Outstanding face value
    *** CNY
  • Increment
    *** CNY

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Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

11/06/2026 New issues: Tencent Holdings issued international bonds (US88032XBF06, US88032XBE31) in the amount of USD 700, USD 1750 mln maturing in 2046, 2036 respectively.
12/11/2025 Tencent Holdings Limited (TCEHY) Earnings Preview
22/09/2025 New issue: Tencent Holdings issued bonds (HK0001193041) with the coupon rate of 2.5% in the amount of CNY 6000 mln maturing in 2035
15/09/2025 Upcoming Issue: Tencent Holdings 5Y
15/09/2025 Upcoming Issue: Tencent Holdings 3Y
All organization news

IFRS/US GAAP reports

2026
I q eng
II q eng
2025
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2024
I q eng
II q eng
III q eng
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2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
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Related entities on 30/09/2021

Have shares in the company

Identifiers

  • ISIN
    HK0001307179
  • Cbonds ID
    2274795
  • Common Code
    339694125
  • CFI
    DTFNFR
  • FIGI
    BBG022W00P38
  • Ticker
    TENCNT 2.5 06/16/36 GMTN
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Foreign bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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