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STMicroelectronics, 0.625% 23jun2033, USD (Conv.) (FIGI RegS BBG02311MBL5, XS3416917709, WKN A4EWP4)

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International bonds, Convertible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
750,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Netherlands
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    750,000,000 USD
  • Outstanding amount
    750,000,000 USD
  • USD equivalent
    750,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • ISIN RegS
    XS3416917709
  • Common Code RegS
    341691770
  • CFI RegS
    DCFNFR
  • FIGI RegS
    BBG02311MBL5
  • Ticker
    STM 0.625 06/23/33 B
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Issue information

Profile
STMicroelectronics is a French-Italian multinational electronics and semiconductor manufacturer headquartered in Geneva, Switzerland. It is Europe's largest semiconductor chip maker based on revenue. ST is among the world leaders in a broad range of segments, including ...
STMicroelectronics is a French-Italian multinational electronics and semiconductor manufacturer headquartered in Geneva, Switzerland. It is Europe's largest semiconductor chip maker based on revenue. ST is among the world leaders in a broad range of segments, including semiconductors for industrial applications, inkjet printheads, MEMS (Micro-Electro-Mechanical Systems), MPEG decoders and smartcard chips, automotive integrated circuits, computer peripherals, and chips for wireless and mobile applications. While STMicroelectronics corporate headquarters and the headquarters for EMEA region are based in Geneva, the holding company, STMicroelectronics N.V. is registered in Amsterdam, Netherlands.
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Volume
  • Placement amount
    750,000,000 USD
  • Outstanding amount
    750,000,000 USD
  • Outstanding face value amount
    750,000,000 USD
Face value
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    200,000 USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***

Conversion and exchange

  • Initial premium
    ***%
  • Convertible until
    ***
  • Lock-up
    *** days
  • Conversion terms
    ***

Latest issues

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News

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IFRS/US GAAP reports

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Identifiers

  • ISIN RegS
    XS3416917709
  • Cbonds ID
    2240915
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    341691770
  • CFI RegS
    DCFNFR
  • FIGI RegS
    BBG02311MBL5
  • WKN RegS
    A4EWP4
  • Ticker
    STM 0.625 06/23/33 B
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Convertible
  • Amortization
  • Callable
  • CDO
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

Holders

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