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Intel, 6.2% 15may2066, USD (FIGI BBG021YQQ1C6, WKN A4ET8L)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
500,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    500,000,000 USD
  • USD equivalent
    500,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFNGR
  • FIGI
    BBG021YQQ1C6
  • Ticker
    INTC 6.2 05/15/66
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Issue information

Profile
Intel Corporation designs, manufactures, and sells computer components and related products. The Company major products include microprocessors, chipsets, embedded processors and microcontrollers, flash memory, graphic, network and communication, systems management software, conferencing, and digital imaging products.
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Volume
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    500,000,000 USD
  • Outstanding face value amount
    500,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Representative of the company 7 days FREE trial

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Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds
    Refinance
  • Use of proceeds description
    To repay the bridge loan related to our repurchase from Apollo-managed funds and affiliates of their 49% minority ownership interest in our majority-owned and consolidated joint investment entity with rights related to the factory output from our wafer fabrication plant in Ireland
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

22/08/2026 Intel Sold $20 Billion of Stock at $95 a Share. It Now Trades Below $93.
21/08/2026 Billionaire Investor Stanley Druckenmiller Just Sold Intel and Micron, and Piled Into 2 Artificial Intelligence (AI) Stocks That Are Betting Big on Robotics
20/08/2026 Ride the Market Waves with a Simple Bollinger Band Strategy
20/08/2026 Masayoshi Son Has 67% of SoftBank's U.S. Stock Portfolio in Intel. He Didn't Buy a Single Share Last Quarter.
19/08/2026 Insider Watch: 3 CEOs Betting Millions on Their Own Stocks
All organization news

IFRS/US GAAP reports

2026
I q eng
II q eng
2025
I q eng
II q eng
III q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    2133991
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFNGR
  • FIGI
    BBG021YQQ1C6
  • WKN
    A4ET8L
  • Ticker
    INTC 6.2 05/15/66
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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