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Intel, 5% 15aug2033, USD (FIGI BBG021YQQ001, WKN A4ET8H)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
1,000,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    1,000,000,000 USD
  • Outstanding amount
    1,000,000,000 USD
  • USD equivalent
    1,000,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFNGR
  • FIGI
    BBG021YQQ001
  • SEDOL
    BVFCB26
  • Ticker
    INTC 5 08/15/33

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Issue information

Profile
Intel Corporation designs, manufactures, and sells computer components and related products. The Company major products include microprocessors, chipsets, embedded processors and microcontrollers, flash memory, graphic, network and communication, systems management software, conferencing, and digital imaging products.
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Volume
  • Placement amount
    1,000,000,000 USD
  • Outstanding amount
    1,000,000,000 USD
  • Outstanding face value amount
    1,000,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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1 000 000

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stocks

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ETF & Funds

100 000

indices

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— Are you looking for the complete & verified bond data?

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds
    Refinance
  • Use of proceeds description
    To repay the bridge loan related to our repurchase from Apollo-managed funds and affiliates of their 49% minority ownership interest in our majority-owned and consolidated joint investment entity with rights related to the factory output from our wafer fabrication plant in Ireland
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Issue is included in calculation of indices

Cbonds USA Corporate BBB Duration Index
Cbonds USA Corporate BBB G-Spread Index
Cbonds USA Corporate BBB Index TR
Cbonds USA Corporate BBB Price Index
Cbonds USA Corporate BBB T-Spread Index
Cbonds USA Corporate BBB YTM Index
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Latest issues

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News

12/08/2026 Intel Dropped After Strong Earnings. Here Is What $1,000 Invested Could Return Over 3 Years.
12/08/2026 Intel: More Capital Put At Work (NASDAQ:INTC) | Seeking Alpha
12/08/2026 Intel Is Raising Billions in Equity. History Says This Is What the Stock Will Do Next.
11/08/2026 Does Intel's Revenue Growth Signal a Turnaround in Its Fortunes?
11/08/2026 Intel Increases Size of Stock Offering to Raise $20 Billion
All organization news

IFRS/US GAAP reports

2026
I q eng
II q eng
2025
I q eng
II q eng
III q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    2133985
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFNGR
  • FIGI
    BBG021YQQ001
  • WKN
    A4ET8H
  • SEDOL
    BVFCB26
  • Ticker
    INTC 5 08/15/33
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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