Hint mode is switched on Switch off
For swift navigation between sections

TongFu Microelectronics Bonds, 2% 22apr2029, CNY (FIGI BBG021T3HLJ2, 102681560, CND1000BB5F3)

Download
Copy issue information to clipboard
Copy issue information to clipboard
Copy to clipboard
Data copied to the clipboard

PDF download

Choose all Reset all
Download Cancel

FIND, SAVE & TRACK INVESTMENTS WITH CBONDS WATCHLIST

With Cbonds Watchlist you can always stay updated on your investments to make conscious decisions!

Watchlist
You need to request access

Domestic bonds

Status
Outstanding
Amount
300,000,000 CNY
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
China
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    300,000,000 CNY
  • Outstanding amount
    300,000,000 CNY
  • USD equivalent
    44,485,865.73 USD
  • Face value
    100 CNY
  • ISIN
    CND1000BB5F3
  • CFI
    DBFXFR
  • FIGI
    BBG021T3HLJ2
  • Ticker
    TFMCRE 2 04/22/29 MTN
Cbonds API

Get Financial Data Automatically via API

Receive pricing and descriptive data for

  • Bonds
  • Stocks
  • Indices
  • ETFs
  • Funds
  • Global data coverage: Descriptive data, Prices, cash flow, bond prospectuses, IFRS reports
  • Easy Integration: API • Data Feeds • Web Services
  • Transparent Pricing: Tailored to your needs
Trial access

Try in 7-days Trial access

Free for company representative

  • Get full online access to the database
  • Use our powerful bond screener
  • Track bond prices from 400+ sources
  • Smart Portfolio Monitoring
  • Evaluate advanced analytical tools
Unlock Data
Welcome to Cbonds
New to Cbonds? · Take a 90-second tour of the platform.

Discover what you can do with Cbonds

Everything you need for fixed income research and monitoring.

  • 00:23 Coverage
  • 00:40 Bond screener
  • 00:54 Parameters
  • 01:10 Watchlist, Mobile app
  • 01:15 Excel Add-in
Get access Watch full tour

Trading chart

Stock exchange selection
Stock exchange selection
More about Cbonds Estimation
No more than two exchanges can be selected for comparison at the same time
Data display in a chart | table
Data display in a chart | table
Work with the chart: switching the price, period, issue comparison
Work with the chart: switching the price, period, issue comparison
Customize fields in the table
Found:
Show all fields
from
to
ADD-IN
Cbonds add-in API
bond data api
Authorization required
You need to request access
* Data is not available within the selected subscription

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Issue information

Profile
TongFu Microelectronics Co Ltd provides assembling and testing service for memory, microprocessor, micro-controller, hybrid circuit, analog circuit, and other related services throughout China.
Research report by Cbonds-PRAAMS Save
Authorization required
Report download is available only paid Premium subscription access
Volume
  • Placement amount
    300,000,000 CNY
  • Outstanding amount
    300,000,000 CNY
  • Outstanding face value amount
    300,000,000 CNY
  • USD equivalent
    44,485,866 USD
Face value
  • Face value
    100 CNY
  • Outstanding face value
    *** CNY
  • Increment
    *** CNY

Get access to the largest bond database

Try in 7-days Demo access

Free for company representative

  • Evaluate advanced analytical tools
  • Get full online access to the database
  • Try our powerful bond screener
  • Track bond prices from 400+ sources

Get access to the largest bond database

Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Order book
    *** - ***
  • Placement
    *** - ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

Show all

Similar issues

News

28/01/2026 Upcoming Issue: TongFu Microelectronics
All organization news

Identifiers

  • State registration number
    102681560
  • ISIN
    CND1000BB5F3
  • Cbonds ID
    2133147
  • CFI
    DBFXFR
  • FIGI
    BBG021T3HLJ2
  • Ticker
    TFMCRE 2 04/22/29 MTN
  • Type of security by CBR
    ***

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
Show more Hide

Restructuring

***

Registration is required to get access.