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Hon Hai Precision Industry Bonds, 1.72% 14jan2033, TWD (FIGI BBG01ZG8VWQ3, B644DW, TW000B644DW0)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
900,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    900,000,000 TWD
  • Outstanding amount
    900,000,000 TWD
  • USD equivalent
    28,384,004.04 USD
  • Face value
    1,000,000 TWD
  • ISIN
    TW000B644DW0
  • CFI
    DBFUFR
  • FIGI
    BBG01ZG8VWQ3
  • Ticker
    HONHAI 1.72 01/14/33 151C
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Issue information

Profile
Hon Hai Precision Industry Co., Ltd. provides electronic manufacturing services for computers, communications, and consumer electronic products. The Company's business operations include desktop and notebook PC assembly, connector production, cable assembly, PCB assembly, handset manufacturing, networking ...
Hon Hai Precision Industry Co., Ltd. provides electronic manufacturing services for computers, communications, and consumer electronic products. The Company's business operations include desktop and notebook PC assembly, connector production, cable assembly, PCB assembly, handset manufacturing, networking equipment, and other consumer electronic devices manufacturing.
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Volume
  • Placement amount
    900,000,000 TWD
  • Outstanding amount
    900,000,000 TWD
  • Outstanding face value amount
    900,000,000 TWD
  • USD equivalent
    28,384,004 USD
Face value
  • Face value
    1,000,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Representative of the company 7 days FREE trial

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Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

15/06/2026 Schneider Electric Partners With Foxconn To Develop Next-generation AI Data Center Infrastructure
13/08/2025 Hon Hai Precision Industry: Subsidiary CNT SG obtaining FII AMC Shares
05/08/2025 Hon Hai Precision Industry: Un-Audited Monthly Sales Ended July 31, 2025
04/08/2025 Hon Hai Precision Industry: Subsidiary Disposal of Land, Buildings & Machinery
31/07/2025 Hon Hai Precision Industry: Subsidiary Announces Abnormal Trading Fluctuations
All organization news

IFRS/US GAAP reports

2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
IV q eng
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Identifiers

  • State registration number
    B644DW
  • ISIN
    TW000B644DW0
  • Cbonds ID
    2066665
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUFR
  • FIGI
    BBG01ZG8VWQ3
  • Ticker
    HONHAI 1.72 01/14/33 151C
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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