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Liling Hitech Industry Development Bonds, 7.9% 12aug2028, CNY (FIGI BBG0125D92M2, CND10004LRP0)
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Domestic bonds
Status
Outstanding
Amount
170,000,000 CNY
Placement
Redemption (put/call option)
ACI
CNY
No data
Country of risk
China
Current coupon
Price
Yield / Duration
The Liling Hitech Industry Development bond CND10004LRP0 is a CNY-denominated Undefined debt security with a maturity date of 12/08/2028. The bond has the following coupon terms: 7.9%; with interest paid 1 time a year to holders. The bond currently holds the status outstanding and reflects a country of risk of China. Key parameters of the issue include a face value of 100 CNY, a placement amount of 170,000,000 CNY and an outstanding amount of 170,000,000 CNY, which together indicate how much of the debt remains in circulation. The issue carries embedded put options detailed in the redemption schedule. In essence, this means that the holder may sell it back to the issuer on set dates. For reference and reconciliation, the bond is identified by ISIN - CND10004LRP0, FIGI - BBG0125D92M2, CFI - DMMXXR, Ticker - LILNHI V7.9 08/12/28.
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