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JP Morgan Bonds, 3.18% 4sep2027, HKD (25) (FIGI BBG01WXTZG77, HK0001186201)

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Domestic bonds, Foreign bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
390,000,000 HKD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    390,000,000 HKD
  • Outstanding amount
    390,000,000 HKD
  • USD equivalent
    49,698,812.45 USD
  • Face value
    1,000,000 HKD
  • ISIN
    HK0001186201
  • Common Code
    317158050
  • CFI
    DTFUFR
  • FIGI
    BBG01WXTZG77
  • Ticker
    JPM 3.18 09/04/27 EMTN

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Issue information

Profile
JPMorgan Chase & Co. provides global financial services and retail banking. The Company provides services such as investment banking, treasury and securities services, asset management, private banking, card member services, commercial banking, and home finance. JP ...
JPMorgan Chase & Co. provides global financial services and retail banking. The Company provides services such as investment banking, treasury and securities services, asset management, private banking, card member services, commercial banking, and home finance. JP Morgan Chase serves business enterprises, institutions, and individuals.
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Volume
  • Placement amount
    390,000,000 HKD
  • Outstanding amount
    390,000,000 HKD
  • Outstanding face value amount
    390,000,000 HKD
  • USD equivalent
    49,698,812 USD
Face value
  • Face value
    1,000,000 HKD
  • Outstanding face value
    *** HKD
  • Increment
    *** HKD

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Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

23/07/2026 JPMorgan Chase (NYSE: JPM) Achieves Record Profit Amidst Analyst Upgrade
22/07/2026 New issue: JP Morgan issued international bonds (US48128BAT89) in the amount of USD 3000 mln maturing in 2041
21/07/2026 New issue: JP Morgan issued international bonds (US48128BAW19) in the amount of USD 500 mln maturing in 2030
21/07/2026 New issue: JP Morgan issued international bonds (US48128BAU52) in the amount of USD 3000 mln maturing in 2032
14/07/2026 JPMorganChase Reports Second-Quarter 2026 Financial Results
All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Related entities

In which the company has interests

Identifiers

  • ISIN
    HK0001186201
  • Cbonds ID
    1927269
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    317158050
  • CFI
    DTFUFR
  • FIGI
    BBG01WXTZG77
  • Ticker
    JPM 3.18 09/04/27 EMTN
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Foreign bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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