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Episil Technologies Inc Bonds, 0% 20aug2030, TWD (Conv.) (FIGI BBG01WN8Q104, 37075, TW0003707501)
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Domestic bonds, Convertible, Zero-coupon bonds, Senior Unsecured
Status
Outstanding
Amount
1,000,000,000 TWD
Placement
Redemption (put/call option)
ACI
TWD
No data
Country of risk
Taiwan
Current coupon
Price
Yield / Duration
The Episil Technologies Inc bond TW0003707501 is a TWD-denominated Senior Unsecured debt security with a maturity date of 20/08/2030. The bond has the following coupon terms: 0.00%. The bond currently holds the status outstanding and reflects a country of risk of Taiwan. On this page you can track quotes from 1 source (such as exchange or market participant), including bid and ask quotes if any, and follow changes in the bond's price and yield over time. Key parameters of the issue include a face value of 100,000 TWD, a placement amount of 1,000,000,000 TWD and an outstanding amount of 1,000,000,000 TWD, which together indicate how much of the debt remains in circulation. The issue carries embedded call and put options detailed in the redemption schedule. In essence, this means that the issuer may redeem it early and the holder may sell it back on set dates. For reference and reconciliation, the bond is identified by ISIN - TW0003707501, FIGI - BBG01WN8Q104, CFI - DCZUDR, Ticker - EPISHI 0 08/20/30 5.
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