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United Microelectronics Corporation Bonds, 1.94% 27jun2030, TWD (FIGI BBG01VPSR1R0, B638BJ, TW000B638BJ3)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
2,000,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    2,000,000,000 TWD
  • Outstanding amount
    2,000,000,000 TWD
  • USD equivalent
    62,410,285.22 USD
  • Face value
    1,000,000 TWD
  • ISIN
    TW000B638BJ3
  • CFI
    DBFUFR
  • FIGI
    BBG01VPSR1R0
  • Ticker
    UNIMIC 1.94 06/27/30 141A

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Issue information

Profile
United Microelectronics Corporation was founded as Taiwan's first semiconductor company in 1980 as a spin-off of the government-sponsored Industrial Technology Research Institute (ITRI)
Research report by Cbonds-PRAAMS Save
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Report download is available only paid Premium subscription access
Volume
  • Placement amount
    2,000,000,000 TWD
  • Outstanding amount
    2,000,000,000 TWD
  • Outstanding face value amount
    2,000,000,000 TWD
  • USD equivalent
    62,410,285 USD
Face value
  • Face value
    1,000,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

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indices

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

Show all

Similar issues

News

29/04/2026 United Microelectronics Corporation (NYSE: UMC) Earnings Preview: Financial Health and Growth Outlook
29/01/2026 United Microelectronics Corporation (NYSE:UMC) Faces Downgrade and Price Target Cut by BNP Paribas
19/02/2025 United Microelectronics Unit Decides Against Paying Dividend
18/09/2024 United Microelectronics Buys Machinery, Equipment for NT$1.04 Billion
01/07/2021 New bond issue: United Microelectronics Corporation issued international bonds (XS2358241243) with a 0% coupon maturing in 2026
All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
IV q eng
Show more Hide
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Identifiers

  • State registration number
    B638BJ
  • ISIN
    TW000B638BJ3
  • Cbonds ID
    1882121
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUFR
  • FIGI
    BBG01VPSR1R0
  • Ticker
    UNIMIC 1.94 06/27/30 141A
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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