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Honda Motor, 5.337% 8jul2035, USD (FIGI BBG01VRSVZX1, WKN A4EDD1)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
1,000,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Japan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    1,000,000,000 USD
  • Outstanding amount
    1,000,000,000 USD
  • USD equivalent
    1,000,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFNFR
  • FIGI
    BBG01VRSVZX1
  • Ticker
    HNDA 5.337 07/08/35

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Issue information

Profile
HONDA MOTOR CO., LTD. develops, produces and manufactures a variety of motor products. The Company has four business segments. The Motorcycle segment provides motorcycles, all-terrain vehicle (ATV) and related parts. The Automobile segment provides automobiles and ...
HONDA MOTOR CO., LTD. develops, produces and manufactures a variety of motor products. The Company has four business segments. The Motorcycle segment provides motorcycles, all-terrain vehicle (ATV) and related parts. The Automobile segment provides automobiles and related parts. The Financial Service segment offers financing and insurance services. The Generic Business and Others Business segment provides general purpose products and related parts.
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Volume
  • Placement amount
    1,000,000,000 USD
  • Outstanding amount
    1,000,000,000 USD
  • Outstanding face value amount
    1,000,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds
    General Corporate Purposes
    Capital Expenditures
  • Use of proceeds description
    Capital Expenditures, General Corporate Purposes
Participants
  • Bookrunner
    ***, ***, ***
  • Depository
    ***, ***, ***
  • Arranger Legal Adviser (Domestic law)
    ***
  • Arranger Legal Adviser (International law)
    ***
  • Issuer Legal Adviser (Domestic law)
    ***
  • Issuer Legal Adviser (International law)
    ***

Conversion and exchange

  • Conversion terms
    ***

Issue is included in calculation of indices

Cbonds Japan Corporate IG USD Duration Index
Cbonds Japan Corporate IG USD G-spread Index
Cbonds Japan Corporate IG USD Index
Cbonds Japan Corporate IG USD Price Index
Cbonds Japan Corporate IG USD T-spread Index
Cbonds Japan Corporate IG USD YTM Index
Cbonds Japan Corporate USD Duration Index
Cbonds Japan Corporate USD G-spread Index
Cbonds Japan Corporate USD Index
Cbonds Japan Corporate USD Price Index
Cbonds Japan Corporate USD T-spread Index
Cbonds Japan Corporate USD YTM Index
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News

01/07/2026 New issues: Honda Motor issued international bonds (XS3416874892, XS3416873902, XS3416873738) in the amount of EUR 500, EUR 750, EUR 1250 mln maturing in 2036, 2032, 2029 respectively.
09/01/2026 Upcoming Issue: Honda Motor 7Y
09/01/2026 Upcoming Issue: Honda Motor 3Y
26/12/2025 Honda to Buy Ohio Battery Plant Assets From LGES for $2.9B
13/11/2025 Honda Q2 Earnings Miss Expectations, Revenues Decline Y/Y
All organization news

IFRS/US GAAP reports

2026
I q eng
II q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    1880507
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFNFR
  • FIGI
    BBG01VRSVZX1
  • WKN
    A4EDD1
  • Ticker
    HNDA 5.337 07/08/35
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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