TSMC Bonds, 2.05% 2jun2035, TWD (FIGI BBG01V80Y0B1, B618E1, TW000B618E12)

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Domestic bonds, Senior Unsecured

Issue | Issuer

Issuer

M

*** | ***

***
S&P

*** | ***

***
F

*** | ***

***

Status

Outstanding

Amount

1,600,000,000 TWD

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

Taiwan

Current coupon

***%

Price

Yield / Duration

Placement amount

1,600,000,000 TWD
Outstanding amount

1,600,000,000 TWD
USD equivalent

50,588,086.51 USD
Face value

10,000,000 TWD
ISIN

TW000B618E12
CFI

DBFUFR
FIGI

BBG01V80Y0B1
Ticker

TAISEM 2.05 06/02/35 142B

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Issue information

Profile

Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.

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Issuer

Go to the issuer page
TSMC
Full borrower / issuer name

TSMC
Sector

Corporate
Industry

Semiconductors
Stocks

TSMC, ordinary share
TSMC, American depositary receipt (ADR)
TSMC, Brazilian depositary receipt (GDR)
TSMC, depositary receipt

Volume

Placement amount

1,600,000,000 TWD
Outstanding amount

1,600,000,000 TWD
Outstanding face value amount

1,600,000,000 TWD
USD equivalent

50,588,087 USD

Face value

Face value

10,000,000 TWD
Outstanding face value

*** TWD
Increment

*** TWD

Listing

Listing

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Private investor

Individual access

Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

Export to Excel

Early redemption terms

***

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1 000 000

bonds

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ETF & Funds

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Bond Search
Watchlist
Excel ADD-IN

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— Are you looking for the complete & verified bond data?

— We have everything you need:

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

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Placement

Placement method

Open subscription
Placement type

Public
Placement

***
Geographic breakdown

***
Investor breakdown

***

Participants

Bookrunner

***, ***, ***, ***, ***, ***, ***

Conversion and exchange

Conversion terms

***

Latest issues

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Similar issues

News

03/08/2026	New issue: TSMC issued bonds (TW000B618ED2) with the coupon rate of 2.03% in the amount of TWD 14000 mln maturing in 2031
17/07/2026	TSMC Outlook Boosted by AI Growth, Analyst Raises Target
16/07/2026	Taiwan Semiconductor Manufacturing Company (NYSE: TSM): Strong AI-Driven Earnings Amidst Valuation Scrutiny
16/07/2026	Taiwan Semiconductor Manufacturing Company (NYSE:TSM) Earnings Preview: A Crucial Test for the AI Sector
06/07/2026	TSMC: A Critical Player in the AI Semiconductor Market (NYSE: TSM)

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IFRS/US GAAP reports

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Identifiers

State registration number

B618E1
ISIN

TW000B618E12
Cbonds ID

1863023
CUSIP

***
CUSIP 144A

***
CFI

DBFUFR
FIGI

BBG01V80Y0B1
Ticker

TAISEM 2.05 06/02/35 142B
Type of security by CBR

***

Ratings

Bond classification

Senior Unsecured
Registered
Coupon bonds
Non-complex financial instruments (MiFID)
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***