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TSMC Bonds, 1.92% 2jun2030, TWD (FIGI BBG01V80V4D4, B618DZ, TW000B618DZ7)

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Domestic bonds, Green bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
12,500,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    12,500,000,000 TWD
  • Outstanding amount
    12,500,000,000 TWD
  • USD equivalent
    390,064,282.59 USD
  • Face value
    10,000 TWD
  • ISIN
    TW000B618DZ7
  • CFI
    DBFUFR
  • FIGI
    BBG01V80V4D4
  • Ticker
    TAISEM 1.92 06/02/30 142A

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Issue information

Profile
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes ...
Established in 1987, TSMC is the world's first dedicated semiconductor foundry. As the founder and a leader of the Dedicated IC Foundry segment, TSMC has built its reputation by offering advanced and "More-than-Moore" wafer production processes and unparalleled manufacturing efficiency. From its inception, TSMC has consistently offered the foundry segment's leading technologies and TSMC COMPATIBLE design services. TSMC has consistently experienced strong growth by building solid partnerships with its customers, large and small. IC suppliers from around the world trust TSMC with their manufacturing needs, thanks to its unique integration of cutting-edge process technologies, pioneering design services, manufacturing productivity and product quality.
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Volume
  • Placement amount
    12,500,000,000 TWD
  • Outstanding amount
    12,500,000,000 TWD
  • Outstanding face value amount
    12,500,000,000 TWD
  • USD equivalent
    390,064,283 USD
Face value
  • Face value
    10,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

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Early redemption terms

***

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1 000 000

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100 000

indices

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

03/08/2026 New issue: TSMC issued bonds (TW000B618ED2) with the coupon rate of 2.03% in the amount of TWD 14000 mln maturing in 2031
17/07/2026 TSMC Outlook Boosted by AI Growth, Analyst Raises Target
16/07/2026 Taiwan Semiconductor Manufacturing Company (NYSE: TSM): Strong AI-Driven Earnings Amidst Valuation Scrutiny
16/07/2026 Taiwan Semiconductor Manufacturing Company (NYSE:TSM) Earnings Preview: A Crucial Test for the AI Sector
06/07/2026 TSMC: A Critical Player in the AI Semiconductor Market (NYSE: TSM)
All organization news

IFRS/US GAAP reports

2025
IV q eng
2024
IV q eng
2023
IV q eng
2022
IV q eng
2021
IV q eng
2020
IV q eng
2019
IV q eng
2018
IV q eng
2017
IV q eng
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Identifiers

  • State registration number
    B618DZ
  • ISIN
    TW000B618DZ7
  • Cbonds ID
    1863021
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUFR
  • FIGI
    BBG01V80V4D4
  • Ticker
    TAISEM 1.92 06/02/30 142A
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Green bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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