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Micron Technology, 5.65% 1nov2032, USD (FIGI BBG01TQ0C9G6, WKN A4EAMH)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
72,978,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    72,978,000 USD
  • USD equivalent
    72,978,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFNGR
  • FIGI
    BBG01TQ0C9G6
  • Ticker
    MU 5.65 11/01/32

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Issue information

Profile
Micron Technology is a global manufacturer and marketer of semiconductor devices, principally Dynamic Random Access Memory (DRAM), NAND Flash and NOR Flash memory, as well as other memory technologies. The Company has four segments: DRAM Solutions ...
Micron Technology is a global manufacturer and marketer of semiconductor devices, principally Dynamic Random Access Memory (DRAM), NAND Flash and NOR Flash memory, as well as other memory technologies. The Company has four segments: DRAM Solutions Group (DSG), NAND Solutions Group (NSG), Wireless Solutions Group (WSG) and Embedded Solutions Group (ESG) / 07.12
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Volume
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    72,978,000 USD
  • Outstanding face value amount
    72,978,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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indices

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— Are you looking for the complete & verified bond data?

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds
    General Corporate Purposes
    Refinance
  • Use of proceeds description
    Micron intends to use the net proceeds from the sale of the notes to pay the redemption price of the 2027 notes Redemption, to pay the cost of unwinding the fixed-to-floating interest rate swaps Micron entered into in connection with the 2027 notes, and any remainder of the net proceeds for general corporate purposes, which may include the repayment of Micron's other indebtedness.
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

15/08/2026 Should You Buy Micron Technology Stock Below $920 per Share? Wall Street Thinks It's Heading to $1,500.
13/08/2026 Why Micron Stock Rallied on Thursday
13/08/2026 Micron and Sandisk Stock Have Plummeted. Here's Why Now Is the Perfect Time to Buy
11/08/2026 Micron Stock Could Be Worth $2,000 by 2030. Here Is the Bull Case
11/08/2026 This Is the Big Question With Micron Technology Stock
All organization news

IFRS/US GAAP reports

2026
I q eng
II q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    1843427
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFNGR
  • FIGI
    BBG01TQ0C9G6
  • WKN
    A4EAMH
  • Ticker
    MU 5.65 11/01/32
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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