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SK Hynix Bonds, 3.723% 8apr2029, KRW (FIGI BBG01M65NP29, KR6000662E40)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
300,000,000,000 KRW
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Republic of Korea
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    300,000,000,000 KRW
  • Outstanding amount
    300,000,000,000 KRW
  • USD equivalent
    211,804,574.98 USD
  • Face value
    10,000 KRW
  • ISIN
    KR6000662E40
  • CFI
    DBFNFB
  • FIGI
    BBG01M65NP29
  • Ticker
    HYUELE 3.723 04/08/29 2252
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Issue information

Profile
SK Hynix Inc.(formerly Hynix Semiconductor Inc.) is a South Korean memory semiconductor supplier of dynamic random access memory ('DRAM') chips and flash memory chips. The company is in a list of largest semiconductor companies. Changed the ...
SK Hynix Inc.(formerly Hynix Semiconductor Inc.) is a South Korean memory semiconductor supplier of dynamic random access memory ('DRAM') chips and flash memory chips. The company is in a list of largest semiconductor companies. Changed the Company name to 'SK hynix Inc.' in March 2012.
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Volume
  • Placement amount
    300,000,000,000 KRW
  • Outstanding amount
    300,000,000,000 KRW
  • Outstanding face value amount
    300,000,000,000 KRW
  • USD equivalent
    211,804,575 USD
Face value
  • Face value
    10,000 KRW
  • Outstanding face value
    *** KRW
  • Increment
    *** KRW

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Representative of the company 7 days FREE trial

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Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

17/08/2026 SK Hynix's Stock Trades at Around 5 Times Next Year's Earnings Even After Revenue Grew 257%. Here's What a Multiple That Low Usually Signals About a Cyclical Business.
17/08/2026 Why This Memory Chip Boom May Have More Staying Power Than History Suggests
16/08/2026 Why SK Hynix Stock Skyrocketed This Week
15/08/2026 SK Hynix Approved $38 Billion of New Memory Fabs That Won't Produce a Chip Before December 2028
14/08/2026 Not Micron, Not Sandisk. This Artificial Intelligence (AI) Memory Stock Could Be the Next Nvidia.
All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
IV q eng
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Identifiers

  • ISIN
    KR6000662E40
  • Cbonds ID
    1823225
  • CFI
    DBFNFB
  • FIGI
    BBG01M65NP29
  • Ticker
    HYUELE 3.723 04/08/29 2252
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Bearer
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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