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Advanced Micro Devices, 4.319% 24mar2028, USD (FIGI BBG01SRNJX13, WKN A4D8F1)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
625,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    625,000,000 USD
  • Outstanding amount
    625,000,000 USD
  • USD equivalent
    625,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFNGR
  • FIGI
    BBG01SRNJX13
  • Ticker
    AMD 4.319 03/24/28
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Issue information

Profile
Advanced Micro Devices, Inc. (AMD) is a global semiconductor company with facilities around the world. The Company offers x86 microprocessors, as standalone devices or as incorporated as an accelerated processing unit (APU), for the commercial and ...
Advanced Micro Devices, Inc. (AMD) is a global semiconductor company with facilities around the world. The Company offers x86 microprocessors, as standalone devices or as incorporated as an accelerated processing unit (APU), for the commercial and consumer markets, embedded microprocessors for commercial, commercial client and consumer markets and chipsets for desktop and mobile devices, including mobile personal computers, or PCs, and tablets, professional workstations and servers and graphics, video and multimedia products for desktop and mobile devices, including mobile PCs and tablets, home media PCs and professional workstations, servers and technology for game consoles. In September 2013, Advanced Micro Devices Inc announced that its Singapore subsidiary, Advanced Micro Devices (Singapore) Pte Ltd. completed a transaction to sell and lease-back its Singapore facility located at 508 Chai Chee Lane, Singapore 469032 to HSBC Institutional Trust Services (Singapore) Limited.
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Volume
  • Placement amount
    625,000,000 USD
  • Outstanding amount
    625,000,000 USD
  • Outstanding face value amount
    625,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

25/08/2026 Advanced Micro Devices (NASDAQ: AMD) Stock Upgrade: AI Growth and Valuation Insights
18/08/2026 EyePoint Pharmaceuticals (NASDAQ:EYPT) Stock Plunges on DURAVYU Trial Results, Analyst Sees Significant Upside
17/08/2026 New issues: Advanced Micro Devices issued international bonds (US007903BK24, US007903BL07, US007903BM89, US007903BN62) in the amount of USD 1250, USD 1500, USD 1000, USD 1000 mln maturing in 2029, 2031, 2033, 2036 respectively.
14/08/2026 AMD Downgraded by Goldman Sachs Despite Strong Q2 & AI Growth
13/08/2026 Advanced Micro Devices: Entry Into A Material Definitive Agreement, Creation Of A Direct Financial Obligation Or An Obligation Under An, Financial Statements And Exhibits
All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    1812821
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFNGR
  • FIGI
    BBG01SRNJX13
  • WKN
    A4D8F1
  • Ticker
    AMD 4.319 03/24/28
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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