Shanghai Yangpu Technology Innovation (Group) Co Bonds, 2.07% 18feb2030, CNY (FIGI BBG01S9MDNS4, 102580598, CND10008YVV4)

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Domestic bonds

Status

Outstanding

Amount

800,000,000 CNY

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

China

Current coupon

***%

Price

Yield / Duration

Placement amount

800,000,000 CNY
Outstanding amount

800,000,000 CNY
USD equivalent

118,999,364.1 USD
Face value

100 CNY
ISIN

CND10008YVV4
CFI

DBFXFR
FIGI

BBG01S9MDNS4
Ticker

SHYPTI V2.07 02/18/30 MTN

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Issue information

Issuer

Go to the issuer page
Shanghai Yangpu Technology Innovation (Group) Co
Full borrower / issuer name

Shanghai Yangpu Technology Innovation (Group) Co
Sector

Corporate
Industry

Other Financial Institutions

Volume

Placement amount

800,000,000 CNY
Outstanding amount

800,000,000 CNY
Outstanding face value amount

800,000,000 CNY
USD equivalent

118,999,364 USD

Face value

Face value

100 CNY
Outstanding face value

*** CNY
Increment

*** CNY

Get access to the largest bond database

Try in 7-days Demo access

Free for company representative

Evaluate advanced analytical tools
Get full online access to the database
Try our powerful bond screener
Track bond prices from 400+ sources

Get access to the largest bond database

Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

Bond Search
Watchlist
Excel ADD-IN

Get access

— Are you looking for the complete & verified bond data?

— We have everything you need:

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

Get full access to the platform from any device & via Cbonds app

Enhance your portfolio management with Cbonds Excel Add-in

Build yield maps, make chart comparison within a click

Don't wait any longer — start using Cbonds today! Register

Placement

Placement method

Open subscription
Placement type

Public
Order book

*** - ***
Placement

*** - ***
Initial issue price (yield)

(***%)
Geographic breakdown

***
Investor breakdown

***

Conversion and exchange

Conversion terms

***

Latest issues

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Similar issues

News

31/07/2025	Upcoming Issue: Shanghai Yangpu Technology Innovation (Group) Co

31/07/2025

Upcoming Issue: Shanghai Yangpu Technology Innovation (Group) Co

All organization news

Identifiers

State registration number

102580598
ISIN

CND10008YVV4
Cbonds ID

1807223
CFI

DBFXFR
FIGI

BBG01S9MDNS4
Ticker

SHYPTI V2.07 02/18/30 MTN
Type of security by CBR

***

Bond classification

Rank: Undefined
Registered
Coupon bonds
Non-complex financial instruments (MiFID)
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***