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Hengyang High-tech Holding Group Bonds, 2.46% 12jun2029, CNY (FIGI BBG01N799B52, 102482230, CND100081J45)

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Domestic bonds

Status
Outstanding
Amount
735,000,000 CNY
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
China
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    735,000,000 CNY
  • Outstanding amount
    735,000,000 CNY
  • USD equivalent
    109,339,611.06 USD
  • Face value
    100 CNY
  • ISIN
    CND100081J45
  • CFI
    DBFXFR
  • FIGI
    BBG01N799B52
  • Ticker
    HYHTLD V2.46 06/12/29 MTN
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Issue information

  • Issuer
    Go to the issuer page
    Hengyang High-tech Holding Group
  • Full borrower / issuer name
    Hengyang High-tech Holding Group
  • Sector
    Corporate
  • Industry
    Holding Companies
Volume
  • Placement amount
    735,000,000 CNY
  • Outstanding amount
    735,000,000 CNY
  • Outstanding face value amount
    735,000,000 CNY
  • USD equivalent
    109,339,611 USD
Face value
  • Face value
    100 CNY
  • Outstanding face value
    *** CNY
  • Increment
    *** CNY

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  • Try our powerful bond screener
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Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** - ***
  • Placement
    *** - ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

20/06/2025 Upcoming Issue: Hengyang High-tech Holding Group
All organization news

Identifiers

  • State registration number
    102482230
  • ISIN
    CND100081J45
  • Cbonds ID
    1760345
  • CFI
    DBFXFR
  • FIGI
    BBG01N799B52
  • Ticker
    HYHTLD V2.46 06/12/29 MTN
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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