Dazhou Hi Tech Innovation Bonds, 4.5% 7sep2028, CNY (FIGI BBG01J567WJ0, 102382410, CND1000702P0)

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Domestic bonds

Status

Outstanding

Amount

1,000,000,000 CNY

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

China

Current coupon

***%

Price

Yield / Duration

Placement amount

1,000,000,000 CNY
Outstanding amount

1,000,000,000 CNY
USD equivalent

148,749,205.12 USD
Face value

100 CNY
ISIN

CND1000702P0
CFI

DBFXFR
FIGI

BBG01J567WJ0
Ticker

SASACD V4.5 09/07/28 MTN

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Issue information

Profile

Dazhou Hi Tech Innovation Co., Ltd. (formerly Dazhou State-owned Assets Marketing Management Co., Ltd.) is involved in investment, financing, construction, and management. The company was founded in 2000.

Research report by Cbonds-PRAAMS

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Issuer

Go to the issuer page
Dazhou Hi Tech Innovation
Full borrower / issuer name

Dazhou Hi Tech Innovation
Sector

Corporate
Industry

Other Sectors

Volume

Placement amount

1,000,000,000 CNY
Outstanding amount

1,000,000,000 CNY
Outstanding face value amount

1,000,000,000 CNY
USD equivalent

148,749,205 USD

Face value

Face value

100 CNY
Outstanding face value

*** CNY
Increment

*** CNY

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Private investor

Individual access

Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

Bond Search
Watchlist
Excel ADD-IN

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— Are you looking for the complete & verified bond data?

— We have everything you need:

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

Get full access to the platform from any device & via Cbonds app

Enhance your portfolio management with Cbonds Excel Add-in

Build yield maps, make chart comparison within a click

Don't wait any longer — start using Cbonds today! Register

Placement

Placement method

Open subscription
Placement type

Public
Order book

*** - ***
Placement

*** - ***
Initial issue price (yield)

(***%)
Geographic breakdown

***
Investor breakdown

***

Conversion and exchange

Conversion terms

***

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Identifiers

State registration number

102382410
ISIN

CND1000702P0
Cbonds ID

1760251
CFI

DBFXFR
FIGI

BBG01J567WJ0
Ticker

SASACD V4.5 09/07/28 MTN
Type of security by CBR

***

Ratings

Bond classification

Rank: Undefined
Registered
Coupon bonds
Non-complex financial instruments (MiFID)
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***