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JPMorgan Chase Bank Bonds, 3.08% 6nov2029, CNY (FIGI BBG01QJ37BZ4, HK0001075206)

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Domestic bonds, Foreign bonds, Interest at Maturity, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
200,000,000 CNY
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    200,000,000 CNY
  • Outstanding amount
    200,000,000 CNY
  • USD equivalent
    29,657,243.82 USD
  • Face value
    1,000,000 CNY
  • ISIN
    HK0001075206
  • Common Code
    292749830
  • CFI
    DBFNFR
  • FIGI
    BBG01QJ37BZ4
  • Ticker
    JPM 3.08 11/06/29 EMTN
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Issue information

Profile
JPMorgan Chase Bank, National Association provides investment and banking services. The Company offers wealth planning, investing, credit, and other financial services. JPMorgan Chase Bank serves clients worldwide.
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  • Issuer
    Go to the issuer page
    JPMorgan Chase Bank
  • Full borrower / issuer name
    JPMorgan Chase Bank
  • Sector
    Corporate
  • Industry
    Banks
Volume
  • Placement amount
    200,000,000 CNY
  • Outstanding amount
    200,000,000 CNY
  • Outstanding face value amount
    200,000,000 CNY
  • USD equivalent
    29,657,244 USD
Face value
  • Face value
    1,000,000 CNY
  • Outstanding face value
    *** CNY
  • Increment
    *** CNY

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Representative of the company 7 days FREE trial

Professional access to the data

Private investor

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

18/08/2026 Upcoming Issue: JPMorgan Chase Bank Due 06.05.2027
18/08/2026 Upcoming Issue: JPMorgan Chase Bank Due 13.08.2031
29/04/2026 Upcoming Issue: JPMorgan Chase Bank Due 29.04.2029
29/04/2026 Upcoming Issue: JPMorgan Chase Bank Due 28.04.2029
16/04/2026 New issue: JPMorgan Chase Bank issued international bonds (XS3342050617) in the amount of EUR 375 mln maturing in 2031
All organization news

Related entities on 31/12/2020

Have shares in the company

In which the company has interests

Identifiers

  • ISIN
    HK0001075206
  • Cbonds ID
    1752131
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • Common Code
    292749830
  • CFI
    DBFNFR
  • FIGI
    BBG01QJ37BZ4
  • Ticker
    JPM 3.08 11/06/29 EMTN
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Interest at Maturity
  • Foreign bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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