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China Cinda (HK) Holdings, 5.75% 28may2029, USD (007) (FIGI RegS BBG01MZF9R36, XS2823828061, WKN A3LY66)

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International bonds, Guaranteed, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
800,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Hong Kong
Current coupon
***%
Price
Yield / Duration
Reports of guarantors / borrowers / offerers
Guarantor China Cinda (HK) Holdings
  • Placement amount
    800,000,000 USD
  • Outstanding amount
    800,000,000 USD
  • USD equivalent
    800,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • ISIN RegS
    XS2823828061
  • Common Code RegS
    282382806
  • CFI RegS
    DTFNCR
  • FIGI RegS
    BBG01MZF9R36
  • Ticker
    CCAMCL 5.75 05/28/29 EMTN

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Issue information

Profile
China Cinda Holdings Company Limited operates as a subsidiary of China Cinda Asset Management Co., Ltd.
Research report by Cbonds-PRAAMS Save
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Report download is available only paid Premium subscription access
Volume
  • Placement amount
    800,000,000 USD
  • Outstanding amount
    800,000,000 USD
  • Outstanding face value amount
    800,000,000 USD
Face value
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** USD
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
  • Use of proceeds
    General Corporate Purposes
    Bail-In
    Investment
  • Use of proceeds description
    General Corporate Purposes, Working Capital, Investment, Refinance
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***

Conversion and exchange

  • Conversion terms
    ***

Issue is included in calculation of indices

Cbonds Asia Corporate IG USD Duration Index
Cbonds Asia Corporate IG USD G-spread Index
Cbonds Asia Corporate IG USD Index
Cbonds Asia Corporate IG USD Price Index
Cbonds Asia Corporate IG USD T-spread Index
Cbonds Asia Corporate IG USD YTM Index
Cbonds Asia Corporate USD Duration Index
Cbonds Asia Corporate USD G-spread Index
Cbonds Asia Corporate USD Index
Cbonds Asia Corporate USD Price Index
Cbonds Asia Corporate USD T-spread Index
Cbonds Asia Corporate USD YTM Index
Cbonds EM Corporate IG USD Duration Index
Cbonds EM Corporate IG USD G-spread Index
Cbonds EM Corporate IG USD Index
Cbonds EM Corporate IG USD Price Index
Cbonds EM Corporate IG USD T-spread Index
Cbonds EM Corporate IG USD YTM Index
Cbonds EM Corporate USD Duration Index
Cbonds EM Corporate USD G-spread Index
Cbonds EM Corporate USD Index
Cbonds EM Corporate USD Price Index
Cbonds EM Corporate USD T-spread Index
Cbonds EM Corporate USD YTM Index
Cbonds Hong Kong Corporate IG USD Duration Index
Cbonds Hong Kong Corporate IG USD G-spread Index
Cbonds Hong Kong Corporate IG USD Index
Cbonds Hong Kong Corporate IG USD Price Index
Cbonds Hong Kong Corporate IG USD T-spread Index
Cbonds Hong Kong Corporate USD Duration Index
Cbonds Hong Kong Corporate USD G-spread Index
Cbonds Hong Kong Corporate USD Index
Cbonds Hong Kong Corporate USD Price Index
Cbonds Hong Kong Corporate USD T-spread Index
Cbonds Hong Kong Corporate USD YTM Index
Cbonds Hong Kong Corporate USD YTM Index
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Latest issues

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News

17/07/2024 New issues: China Cinda (HK) Holdings issued international bonds (XS2862887663, XS2860787709) in the amount of USD 500, USD 500 mln maturing in 2027, 2030 respectively.
02/08/2023 New issue: Issuer China Cinda (HK) Holdings issued international bonds (XS2662422802) with the coupon rate of 5.75% in the amount of USD 400 mln maturing in 2027
25/01/2022 New bond issue: China Cinda (HK) Holdings issued international bonds (XS2436124205) with a 3.25% coupon maturing in 2027
14/01/2021 New bond issue: China Cinda (HK) Holdings issued international bonds (XS2281799572) with a 3% coupon for USD 800.0m maturing in 2031
14/01/2021 New bond issue: China Cinda (HK) Holdings issued international bonds (XS2281797790) with a 2.5% coupon for USD 400.0m maturing in 2028
All organization news

Identifiers

  • ISIN RegS
    XS2823828061
  • Cbonds ID
    1684065
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    282382806
  • CFI RegS
    DTFNCR
  • FIGI RegS
    BBG01MZF9R36
  • WKN RegS
    A3LY66
  • Ticker
    CCAMCL 5.75 05/28/29 EMTN
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Guaranteed
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

Holders

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