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Hangzhou Lion Electronics Co Bonds, 1.5% 14nov2028, CNY (Conv.) (FIGI BBG019ZVC1T5)

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Domestic bonds, Variable rate, Convertible, Senior Unsecured

Status
Outstanding
Amount
3,390,000,000 CNY
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
China
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    3,390,000,000 CNY
  • Outstanding amount
    3,390,000,000 CNY
  • USD equivalent
    502,631,774.04 USD
  • Face value
    100 CNY
  • FIGI
    BBG019ZVC1T5

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Issue information

Profile
Hangzhou Lion Electronics Co., Ltd. engages in the research and development, production, and supply of microwave radio frequency integrated circuit chips in China. It serves customers in mobile phone, wireless area network, and broadband applications. The ...
Hangzhou Lion Electronics Co., Ltd. engages in the research and development, production, and supply of microwave radio frequency integrated circuit chips in China. It serves customers in mobile phone, wireless area network, and broadband applications. The company is based in Hangzhou, China.
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Volume
  • Placement amount
    3,390,000,000 CNY
  • Outstanding amount
    3,390,000,000 CNY
  • Outstanding face value amount
    3,390,000,000 CNY
  • USD equivalent
    502,631,774 USD
Face value
  • Face value
    100 CNY
  • Outstanding face value
    *** CNY
  • Increment
    *** CNY
Listing
  • Listing

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Cash flow parameters

  • Variable rate type
    Step-up/Step-down
  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

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Early redemption terms

***

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1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

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  • Watchlist
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Get access
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— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Order book
    *** - ***
  • Placement
    *** - ***
  • Initial issue price (yield)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***

Conversion and exchange

  • Convertible until
    ***
  • Conversion terms
    ***

Similar issues

News

21/05/2026 “Hangzhou Lion Microelectronics Co., Ltd.”Indicative Announcement on Lion Convertible Bonds Expected to Meet Conditions for Redemption
05/01/2026 “Hangzhou Lion Microelectronics Co., Ltd.”Announcement on Conversion Result of Convertible Bonds and Share Changes
18/11/2025 “Hangzhou Lion Microelectronics Co., Ltd.”Announcement on Renewing Engagement of Accounting Firm
18/07/2025 Hangzhou Lion Microelectronics Co., Ltd.: Announcement on Not Revising Downward the Conversion Price of Lion Convertible Bonds
All organization news

Identifiers

  • Cbonds ID
    1682249
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • FIGI
    BBG019ZVC1T5
  • Type of security by CBR
    ***

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Convertible
  • Variable rate
  • Non-Marketable Securities
  • Amortization
  • Callable
  • CDO
  • Dual currency bonds
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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