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Sihui Fuji Electronic Technology Bonds, 1.5% 8aug2029, CNY (Conv.) (FIGI BBG01HRW1NJ9)
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Domestic bonds, Variable rate, Convertible, Senior Unsecured
Status
Outstanding
Amount
570,000,000 CNY
Placement
Redemption (put/call option)
ACI
CNY
No data
Country of risk
China
Current coupon
Price
Yield / Duration
The Sihui Fuji Electronic Technology bond is a CNY-denominated Senior Unsecured debt security with a maturity date of 08/08/2029. The bond has the following coupon terms: Step-up/Step-down coupon type with an initial rate of 0.3%; with interest paid 1 time a year to holders. The bond currently holds the status outstanding and reflects a country of risk of China. Key parameters of the issue include a face value of 100 CNY, a placement amount of 570,000,000 CNY and an outstanding amount of 570,000,000 CNY, which together indicate how much of the debt remains in circulation. The issue carries embedded call options detailed in the redemption schedule. In essence, this means that the issuer may redeem it early on set dates. For reference and reconciliation, the bond is identified by FIGI - BBG01HRW1NJ9.
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