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Huzhou Moganshan High-tech Group, 5.48% 16apr2027, USD (FIGI RegS BBG01MCL3VB6, XS2798076696)

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International bonds, Senior Unsecured

Issue | Borrower
Borrower
  • Lianhe RG
    ***   | ***
    ***
Status
Outstanding
Amount
210,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
China
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    210,000,000 USD
  • Outstanding amount
    210,000,000 USD
  • USD equivalent
    210,000,000 USD
  • Minimum Settlement Amount
    200,000 USD
  • ISIN RegS
    XS2798076696
  • Common Code RegS
    279807669
  • CFI RegS
    DBFNFR
  • FIGI RegS
    BBG01MCL3VB6
  • Ticker
    HZMGSG 5.48 04/16/27

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Issue information

Profile
Huzhou Moganshan High-tech Group Co., Ltd. is mainly involved in real estate and urban infrastructure construction and asset management, and also operates in public services sector. The company was founded in 2018.
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  • Borrower
    Go to the issuer page
    Huzhou Moganshan High-tech Group
  • Full borrower / issuer name
    Huzhou Moganshan High-tech Group
  • Sector
    Corporate
  • Industry
    Domestic and Commercial Construction
Volume
  • Placement amount
    210,000,000 USD
  • Outstanding amount
    210,000,000 USD
  • Outstanding face value amount
    210,000,000 USD
Face value
  • Minimum Settlement Amount
    200,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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1 000 000

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100 000

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ETF & Funds

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indices

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— Are you looking for the complete & verified bond data?

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***, ***, ***, ***, ***, ***, ***, ***
  • Depository
    ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

11/04/2024 Upcoming Issue: Huzhou Moganshan High-tech Group
20/01/2022 New bond issue: Huzhou Moganshan High-tech Group issued international bonds (XS2427994889) with a 3.4% coupon maturing in 2025
19/07/2021 New bond issue: Huzhou Moganshan High-tech Group issued international bonds (XS2348679387) with a 3.5% coupon maturing in 2024
All organization news

Identifiers

  • ISIN RegS
    XS2798076696
  • Cbonds ID
    1652953
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    279807669
  • CFI RegS
    DBFNFR
  • FIGI RegS
    BBG01MCL3VB6
  • Ticker
    HZMGSG 5.48 04/16/27
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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