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Chenming Electronic Technology Bonds, 0% 16nov2026, TWD (Conv.) (FIGI BBG01K2FXXT8, 30133, TW0003013306)

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Domestic bonds, Convertible, Zero-coupon bonds, Senior Unsecured

Status
Outstanding
Amount
400,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
The Chenming Electronic Technology bond TW0003013306 is a TWD-denominated Senior Unsecured debt security with a maturity date of 16/11/2026. The bond has the following coupon terms: 0.00%. The bond currently holds the status outstanding and reflects a country of risk of Taiwan. Key parameters of the issue include a face value of 100,000 TWD, a placement amount of 400,000,000 TWD and an outstanding amount of 400,000,000 TWD, which together indicate how much of the debt remains in circulation. The issue carries embedded call options detailed in the redemption schedule. In essence, this means that the issuer may redeem it early on set dates. For reference and reconciliation, the bond is identified by ISIN - TW0003013306, FIGI - BBG01K2FXXT8, CFI - DCZSGR, Ticker - CHENMI 0 11/16/26 3.
  • Placement amount
    400,000,000 TWD
  • Outstanding amount
    400,000,000 TWD
  • USD equivalent
    12,558,081.13 USD
  • Face value
    100,000 TWD
  • ISIN
    TW0003013306
  • CFI
    DCZSGR
  • FIGI
    BBG01K2FXXT8
  • Ticker
    CHENMI 0 11/16/26 3
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Issue information

Profile
Chenming Electronic Technology Corporation manufactures and markets electronic components. The Company produces computer cases, servers, case moulds, phone components, and other products. Chenming Electronic Technology also produces metal injection molding elements.
Research report by Cbonds-PRAAMS Save
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Volume
  • Placement amount
    400,000,000 TWD
  • Outstanding amount
    400,000,000 TWD
  • Outstanding face value amount
    400,000,000 TWD
  • USD equivalent
    12,558,081 USD
Face value
  • Face value
    100,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

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Early redemption terms

***

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Initial premium
    ***%
  • Convertible until
    ***
  • Conversion terms
    ***

Latest issues

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Identifiers

  • State registration number
    30133
  • ISIN
    TW0003013306
  • Cbonds ID
    1559755
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DCZSGR
  • FIGI
    BBG01K2FXXT8
  • Ticker
    CHENMI 0 11/16/26 3
  • Type of security by CBR
    ***

Bond classification

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