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Vanguard International Semiconductor Corp Bonds, 1.68% 25sep2028, TWD (121A) (FIGI BBG01JJCSZQ4, B60910, TW000B609106)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Outstanding
Amount
2,000,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    2,000,000,000 TWD
  • Outstanding amount
    2,000,000,000 TWD
  • USD equivalent
    62,607,606.82 USD
  • Face value
    10,000,000 TWD
  • ISIN
    TW000B609106
  • CFI
    DBFUFR
  • FIGI
    BBG01JJCSZQ4
  • Ticker
    VANGUD 1.68 09/25/28 121A
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Issue information

Profile
Vanguard International Semiconductor Corp offers integrated circuit foundry services.
Research report by Cbonds-PRAAMS Save
Authorization required
Report download is available only paid Premium subscription access
Volume
  • Placement amount
    2,000,000,000 TWD
  • Outstanding amount
    2,000,000,000 TWD
  • Outstanding face value amount
    2,000,000,000 TWD
  • USD equivalent
    62,607,607 USD
Face value
  • Face value
    10,000,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

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1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

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  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

30/01/2026 New issue: Vanguard International Semiconductor Corp issued international bonds (XS3275877143) in the amount of USD 350 mln maturing in 2031
All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
Show more Hide
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Identifiers

  • State registration number
    B60910
  • ISIN
    TW000B609106
  • Cbonds ID
    1534943
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUFR
  • FIGI
    BBG01JJCSZQ4
  • Ticker
    VANGUD 1.68 09/25/28 121A
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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