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Sapporo Bonds, 0.235% 20dec2027, JPY (6th) (FIGI BBG00062K853, 34060155, JP2011001NC8)

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Domestic bonds

Issue | Issuer
Issuer
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
10,000,000,000 JPY
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Japan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    10,000,000,000 JPY
  • Outstanding amount
    10,000,000,000 JPY
  • USD equivalent
    62,734,470.08 USD
  • Face value
    10,000 JPY
  • ISIN
    JP2011001NC8
  • CFI
    DNFTFB
  • FIGI
    BBG00062K853
  • Ticker
    SAPPOR 5 12/20/02 +4-3
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Issue information

Profile
Sapporo is the fourth-largest city in Japan by population, and the largest city on the northern Japanese island of Hokkaido. Located in Ishikari Subprefecture, it is the capital of Hokkaido Prefecture, and an ordinance-designated city of ...
Sapporo is the fourth-largest city in Japan by population, and the largest city on the northern Japanese island of Hokkaido. Located in Ishikari Subprefecture, it is the capital of Hokkaido Prefecture, and an ordinance-designated city of Japan.
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  • Issuer
    Go to the issuer page
    Sapporo
  • Full borrower / issuer name
    Sapporo
  • Sector
    Municipal
Volume
  • Placement amount
    10,000,000,000 JPY
  • Outstanding amount
    10,000,000,000 JPY
  • Outstanding face value amount
    10,000,000,000 JPY
  • USD equivalent
    62,734,470 USD
Face value
  • Face value
    10,000 JPY
  • Outstanding face value
    *** JPY
  • Increment
    *** JPY

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

Track your portfolio in the most efficient way

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Get access
×

— Are you looking for the complete & verified bond data?

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
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Placement

  • Placement method
    Open subscription
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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Similar issues

News

26/06/2025 Upcoming Issue: Sapporo
12/04/2018 New bond issue: Sapporo issued international bonds (XS1807152662) with a 0% coupon for JPY 20,000.0m maturing in 2021
All organization news

Identifiers

  • State registration number
    34060155
  • ISIN
    JP2011001NC8
  • Cbonds ID
    1441760
  • CFI
    DNFTFB
  • FIGI
    BBG00062K853
  • Ticker
    SAPPOR 5 12/20/02 +4-3
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Rank: Undefined
  • Coupon bonds
  • Bearer
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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