Tianma Microelectronics Bonds, 3.9% 15mar2028, CNY (FIGI BBG01FS2H5M6, 102380504, CND100067M71)

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Domestic bonds

Status

Outstanding

Amount

200,000,000 CNY

Placement

***

Redemption (put/call option)

*** (-)

ACI

Country of risk

China

Current coupon

***%

Price

Yield / Duration

Placement amount

200,000,000 CNY
Outstanding amount

200,000,000 CNY
USD equivalent

29,606,711.84 USD
Face value

100 CNY
ISIN

CND100067M71
CFI

DBFXFR
FIGI

BBG01FS2H5M6
Ticker

TMELEC 3.9 03/15/28 MTN

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Issue information

Profile

Tianma Microelectronics Co Ltd manufactures and sells liquid crystal displays (LCDs) and liquid crystal display modules.

Research report by Cbonds-PRAAMS

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Issuer

Go to the issuer page
Tianma Microelectronics
Full borrower / issuer name

Tianma Microelectronics
Sector

Corporate
Industry

IT Services and Computer Programming
Stocks

Tianma Microelectronics, ordinary share

Volume

Placement amount

200,000,000 CNY
Outstanding amount

200,000,000 CNY
Outstanding face value amount

200,000,000 CNY
USD equivalent

29,606,712 USD

Face value

Face value

100 CNY
Outstanding face value

*** CNY
Increment

*** CNY

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Track bond prices from 400+ sources

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Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Cash flow parameters

Reference rate

***

Coupon Rate

***

Day count convention

***

Interest Accrual Date

***

Coupon frequency

*** time(s) per year
Payment currency

***
Maturity date

***

Cash flow

Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

100 000

stocks

175 910

ETF & Funds

100 000

indices

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Bond Search
Watchlist
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— Are you looking for the complete & verified bond data?

— We have everything you need:

Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds

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Enhance your portfolio management with Cbonds Excel Add-in

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Placement

Placement method

Open subscription
Placement type

Public
Order book

*** - ***
Placement

*** - ***
Initial issue price (yield)

(***%)
Geographic breakdown

***
Investor breakdown

***

Conversion and exchange

Conversion terms

***

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Identifiers

State registration number

102380504
ISIN

CND100067M71
Cbonds ID

1440378
CFI

DBFXFR
FIGI

BBG01FS2H5M6
Ticker

TMELEC 3.9 03/15/28 MTN
Type of security by CBR

***

Ratings

Bond classification

Rank: Undefined
Registered
Coupon bonds
Non-complex financial instruments (MiFID)
Amortization
Callable
CDO
Convertible
Dual currency bonds
Variable rate
For qualified investors (CIS region)
Foreign bonds
Green bonds
Guaranteed
Inflation-linked principal
Supranational bond issues
Inflation-linked coupon
Mortgage bonds
Perpetual
Payment-in-kind
Non-Marketable Securities
Redemption Linked
Restructuring
Retail bonds
Covered
Securitization
Structured product
Commercial Bonds
Subordinated
Sukuk
Trace-eligible

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Restructuring

***