Hint mode is switched on Switch off
For swift navigation between sections

STATS ChipPAC, 5.375% 31mar2016, USD (FIGI RegS BBG001CZ3NZ4)

Download
Copy issue information to clipboard
Copy issue information to clipboard
Copy to clipboard
Data copied to the clipboard

PDF download

Choose all Reset all
Download Cancel

International bonds

Status
Matured
Amount
200,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Singapore
Current coupon
-
Price
Yield / Duration
Calculate in two clicks! yield, duration and other parameters
Calculate in two clicks! yield, duration and other parameters
Calculator What is a calculator?
  • Placement amount
    200,000,000 USD
  • Outstanding amount
    200,000,000 USD
  • Minimum Settlement Amount
    100,000 USD
  • Common Code RegS
    057652721
  • CFI RegS
    DBFUGR
  • FIGI RegS
    BBG001CZ3NZ4
  • SEDOL
    B67SLF0
  • Ticker
    STATSP 5.375 03/31/16 REGS

Try in 7-days Trial access

Free for company representative

  • Get full online access to the database
  • Use our powerful bond screener
  • Track bond prices from 400+ sources
  • Smart Portfolio Monitoring
  • Evaluate advanced analytical tools
Sign up

Why Cbonds?

  • 24 Years of Market Leadership
  • Trusted by clients across 90 countries for decades of reliable service
  • Used by Financial Professionals & Fintech central banks, asset managers, fintech innovators
  • Convenient platform for private investors for informed investment decisions

Upgrade to Premium features

Cbonds consolidates global bond, stock, ETF and indices data into a single platform — so you can analyze faster, make informed investment decisions and outperform the market

Get access
Welcome to Cbonds

  • Full access to the largest bond database

    Bond parameters,
    prospectuses

  • Seamless
    Data export

    Analyze the data in the most efficient way

  • Bond pricing

    Current & historical quotes from 400+ stock exchanges & OTC market

  • Smart risk assessment

    Credit ratings, financial reports

Get access

Explore the most comprehensive database

1 000 000

bonds

80 234

stocks

167 970

ETF & Funds

70 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 900 000 bonds, 80 000 stocks, 116 000 ETF & Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 650K bonds, 76K stocks, 8K ETFs
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Files

Prospectus

Authorization required
It is only possible to download bond prospectuses for paid Premium subscription access

Trading chart

Stock exchange selection
Stock exchange selection
More about Cbonds Estimation
No more than two exchanges can be selected for comparison at the same time
Bond is not traded; the issue is redeemed
Data display in a chart | table
Data display in a chart | table
Work with the chart: switching the price, period, issue comparison
Work with the chart: switching the price, period, issue comparison
Customize fields in the table
Found:
Show all fields
from
to
ADD-IN
Cbonds add-in API
bond data api
Authorization required
You need to request access
* Data is not available within the selected subscription

Issue information

Profile
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a ...
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets. Our services include: •Packaging services: providing leaded, laminate, memory card and wafer level chip-scale packages (CSP) to customers with a broad range of packaging solutions and full backend turnkey services for a wide variety of electronics applications. We also provide redistribution layers (RDL), integrated passive devices (IPD) and wafer bumping services for flip chip and wafer level CSPs. As part of customer support on packaging services, we also offer package design; electrical, mechanical and thermal simulation; measurement and design of leadframes and laminate substrates. •Test services: including wafer probe and final testing on a diverse selection of test platforms covering the major test platforms in the industry. We have expertise in testing a broad variety of semiconductors, especially mixed-signal, radio frequency (RF), analog and high-performance digital devices. We also offer test-related services such as burn-in process support, reliability testing, thermal and electrical characterization, dry pack and tape and reel. •Pre-production and post-production services: such as package development, test software and related hardware development, warehousing and drop shipment services. We have a leadership position in providing advanced packages, such as flip chip, stacked die (SD), System-in-Package (SiP), as well as BGA packages and wafer level CSPs. We are also a leader in testing mixed-signal semiconductors or semiconductors combining the use of analog and digital circuits in a chip. Mixed-signal semiconductors are used extensively in fast-growing communications and consumer applications. We have strong expertise in testing a wide range of high-performance digital devices.
Show more Hide
Research report by Cbonds-PRAAMS Save
Authorization required
Report download is available only paid Premium subscription access
  • Borrower
    Go to the issuer page
    STATS ChipPAC
  • Full borrower / issuer name
    STATS ChipPAC
  • Sector
    Corporate
  • Industry
    Semiconductors
Volume
  • Placement amount
    200,000,000 USD
  • Outstanding amount
    200,000,000 USD
Face value
  • Minimum Settlement Amount
    100,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD

Get access to the largest bond database

Try in 7-days Demo access

Free for company representative

  • Evaluate advanced analytical tools
  • Get full online access to the database
  • Try our powerful bond screener
  • Track bond prices from 400+ sources

Get access to the largest bond database

Representative of the company 7 days FREE trial

Professional access to the data

Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
Export to Excel

Early redemption terms

***

Explore the most comprehensive database

1 000 000

bonds

80 234

stocks

167 970

ETF & Funds

70 000

indices

Track your portfolio in the most efficient way

  • Bond Search
  • Watchlist
  • Excel ADD-IN
Get access
×

— Are you looking for the complete & verified bond data?

— We have everything you need:

full data on over 900 000 bonds, 80 000 stocks, 116 000 ETF & Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

Register
×

Why

You will have detailed descriptive & pricing data for 650K bonds, 76K stocks, 8K ETFs
Get full access to the platform from any device & via Cbonds app
Enhance your portfolio management with Cbonds Excel Add-in
Build yield maps, make chart comparison within a click
Don't wait any longer — start using Cbonds today! Register

Placement

  • Placement method
    Open subscription
  • Coupon (Yield) Guidance
    ***% - ***%
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Bids
    *** USD
  • Number of bids
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

Show all

Similar issues

News

18/11/2015 New bond issue: STATS ChipPAC sells USD 425.0m in 2020 bonds with a 8.5% coupon
05/01/2011 Stats ChipPAC mandates Deutsche for US$200m offering
All organization news

Identifiers

  • ISIN RegS
    ***
  • Cbonds ID
    13942
  • ISIN 144A
    ***
  • CUSIP RegS
    ***
  • CUSIP 144A
    ***
  • Common Code RegS
    057652721
  • Common Code 144A
    057652888
  • CFI RegS
    DBFUGR
  • CFI 144A
    DBFUGR
  • FIGI RegS
    BBG001CZ3NZ4
  • FIGI 144A
    BBG001CYBPV7
  • SEDOL
    B67SLF0
  • Ticker
    STATSP 5.375 03/31/16 REGS
  • Type of security by CBR
    ***
Show more Hide

Ratings

Bond classification

  • Rank: Undefined
  • Registered
  • Coupon bonds
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
Show more Hide

Restructuring

***

Registration is required to get access.