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Lam Research, 3.8% 15mar2025, USD (FIGI BBG00882ZQ49, WKN A1ZYEL)

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International bonds, Trace-eligible, Senior Unsecured

Issue | Borrower
Borrower
  • M
    ***  | ***
    ***
  • S&P
    ***  | ***
    ***
  • F
    ***  | ***
    ***
Status
Matured
Amount
500,000,000 USD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
USA
Current coupon
-
Price
Yield / Duration
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    500,000,000 USD
  • Minimum Settlement Amount
    2,000 USD
  • CFI
    DBFUGR
  • FIGI
    BBG00882ZQ49
  • SEDOL
    BVFZF89
  • Ticker
    LRCX 3.8 03/15/25

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Prospectus

Trading chart

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Bond is not traded; the issue is redeemed
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Issue information

Profile
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. Lam Research designs, manufactures, markets, refurbish, and services semiconductor processing equipment used in the fabrication of integrated ...
Lam Research Corporation (Lam Research) is a supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. Lam Research designs, manufactures, markets, refurbish, and services semiconductor processing equipment used in the fabrication of integrated circuits. The Company’s etch and clean technologies enable customers to build integrated circuits. Its etch systems shape the microscopic conductive and dielectric layers into circuits that define a chip’s final use and function. Its Customer Support Business Group (CSBG) provides products and services to maximize installed equipment performance and operational efficiency. Its customer base includes semiconductor memory, foundry, and integrated device manufacturers (IDMs) that make DRAM, NAND, and logic devices for these products. In June 2012, Lam Research completed its merger with Novellus Systems, Inc.
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Volume
  • Placement amount
    500,000,000 USD
  • Outstanding amount
    500,000,000 USD
Face value
  • Minimum Settlement Amount
    2,000 USD
  • Outstanding face value
    *** USD
  • Increment
    *** USD
  • Face value
    1,000 USD
Listing
  • Listing

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Representative of the company 7 days FREE trial

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Private investor

Individual access

Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Calculations for international bonds are made according to the minimum trading lot
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Early redemption terms

***

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indices

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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Initial issue price (yield)
    (***%)
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***
  • Depository
    ***, ***, ***

Conversion and exchange

  • Conversion terms
    ***

Covenants

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Latest issues

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News

02/07/2026 Micron Technology Has Fantastic News for This Artificial Intelligence (AI) Infrastructure Stock That Has More Than Doubled in 2026
01/07/2026 Could Lam Research Be the Next $1 Trillion Company?
19/06/2026 Missed Out on the AI Memory Rally? These 3 Stocks Are Just Getting Started.
19/06/2026 Lam Research (LRCX) Moves 4.0% Higher: Will This Strength Last?
16/06/2026 Lam Research Expects Packaging Growth of 50%: Is It a Hidden Catalyst?
All organization news

IFRS/US GAAP reports

2026
I q eng
2025
I q eng
II q eng
III q eng
IV q eng
2024
I q eng
II q eng
III q eng
IV q eng
2023
I q eng
II q eng
III q eng
IV q eng
2022
I q eng
II q eng
III q eng
IV q eng
2021
I q eng
II q eng
III q eng
IV q eng
2020
I q eng
II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
I q eng
II q eng
III q eng
IV q eng
2016
I q eng
II q eng
III q eng
IV q eng
2015
I q eng
II q eng
III q eng
IV q eng
2014
IV q eng
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Identifiers

  • ISIN
    ***
  • Cbonds ID
    136003
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUGR
  • FIGI
    BBG00882ZQ49
  • WKN
    A1ZYEL
  • SEDOL
    BVFZF89
  • Ticker
    LRCX 3.8 03/15/25
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Trace-eligible
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Non-complex financial instruments (MiFID)
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
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Restructuring

***

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