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Hon Hai Precision Industry Bonds, 1.95% 21oct2032, TWD (113D) (FIGI BBG01B1HV625, B644CP, TW000B644CP6)

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Domestic bonds, Senior Unsecured

Issue | Issuer
Issuer
  • M
    ***   | ***
    ***
  • S&P
    ***   | ***
    ***
  • F
    ***   | ***
    ***
Status
Outstanding
Amount
300,000,000 TWD
Placement
***
Redemption (put/call option)
*** (-)
ACI
Country of risk
Taiwan
Current coupon
***%
Price
Yield / Duration
  • Placement amount
    300,000,000 TWD
  • Outstanding amount
    300,000,000 TWD
  • USD equivalent
    9,483,766.95 USD
  • Face value
    1,000,000 TWD
  • ISIN
    TW000B644CP6
  • CFI
    DBFUFR
  • FIGI
    BBG01B1HV625
  • Ticker
    HONHAI 1.95 10/21/32 113D
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Issue information

Profile
Hon Hai Precision Industry Co., Ltd. provides electronic manufacturing services for computers, communications, and consumer electronic products. The Company's business operations include desktop and notebook PC assembly, connector production, cable assembly, PCB assembly, handset manufacturing, networking ...
Hon Hai Precision Industry Co., Ltd. provides electronic manufacturing services for computers, communications, and consumer electronic products. The Company's business operations include desktop and notebook PC assembly, connector production, cable assembly, PCB assembly, handset manufacturing, networking equipment, and other consumer electronic devices manufacturing.
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Volume
  • Placement amount
    300,000,000 TWD
  • Outstanding amount
    300,000,000 TWD
  • Outstanding face value amount
    300,000,000 TWD
  • USD equivalent
    9,483,767 USD
Face value
  • Face value
    1,000,000 TWD
  • Outstanding face value
    *** TWD
  • Increment
    *** TWD
Listing
  • Listing

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Cash flow parameters

  • Reference rate
    ***
  • Coupon Rate
    ***
  • Day count convention
    ***
  • Interest Accrual Date
    ***
  • Coupon frequency
    *** time(s) per year
  • Payment currency
    ***
  • Maturity date
    ***

Cash flow

Export to Excel

Early redemption terms

***

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1 000 000

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ETF & Funds

100 000

indices

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— Are you looking for the complete & verified bond data?

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full data on over 1 000 000 bonds, 100 000 stocks, 100 000 indices, 17 000 ETF and 150 000 Mutual Funds; powerful bond screener; over 350 pricing sources among stock exchanges & OTC market; ratings & financial reports; user-friendly interface; available anywhere via Website, Excel Add-in and Mobile app.

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Why

You will have detailed descriptive & pricing data for 1M bonds, 100K stocks, 100K indices, 17K ETF and 150K Mutual Funds
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Placement

  • Placement method
    Open subscription
  • Placement type
    Public
  • Placement
    ***
  • Geographic breakdown
    ***
  • Investor breakdown
    ***
Participants
  • Bookrunner
    ***, ***

Conversion and exchange

  • Conversion terms
    ***

Latest issues

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News

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IFRS/US GAAP reports

2025
I q eng
II q eng
III q eng
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2024
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2023
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2022
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2021
I q eng
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2020
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II q eng
III q eng
IV q eng
2019
I q eng
II q eng
III q eng
IV q eng
2018
I q eng
II q eng
III q eng
IV q eng
2017
IV q eng
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Identifiers

  • State registration number
    B644CP
  • ISIN
    TW000B644CP6
  • Cbonds ID
    1354332
  • CUSIP
    ***
  • CUSIP 144A
    ***
  • CFI
    DBFUFR
  • FIGI
    BBG01B1HV625
  • Ticker
    HONHAI 1.95 10/21/32 113D
  • Type of security by CBR
    ***

Ratings

Bond classification

  • Senior Unsecured
  • Registered
  • Coupon bonds
  • Non-complex financial instruments (MiFID)
  • Amortization
  • Callable
  • CDO
  • Convertible
  • Dual currency bonds
  • Variable rate
  • For qualified investors (CIS region)
  • Foreign bonds
  • Green bonds
  • Guaranteed
  • Inflation-linked principal
  • Supranational bond issues
  • Inflation-linked coupon
  • Mortgage bonds
  • Perpetual
  • Payment-in-kind
  • Non-Marketable Securities
  • Redemption Linked
  • Restructuring
  • Retail bonds
  • Covered
  • Securitization
  • Structured product
  • Commercial Bonds
  • Subordinated
  • Sukuk
  • Trace-eligible
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Restructuring

***

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